Asymmetrical interfacial reactions of Ni/SAC101(NiIn)/Ni solder joint induced by current stressing

Chen Yi Lin, Tsung Chieh Chiu, Kwang Lung Lin

Research output: Contribution to journalArticlepeer-review

2 Citations (Scopus)

Abstract

An electric current can asymmetrically trigger either atomic migration or interfacial reactions between a cathode and an anode. The present study investigated the dissolution of metallization and formation of an interfacial intermetallic compound (IMC) in the Cu/Ni/Sn1.0Ag0.1Cu0.02Ni0.05In/Ni/Cu solder joint at various current densities in the order of 103 A/cm2 at temperatures ranging from 100 °C to 150 °C. The polarization behavior of Ni dissolution and IMC formation under current stressing were systematically investigated. The asymmetrical interfacial reactions of the solder joint were found to be greatly influenced by ambient temperature. The dissolution of Ni and its effect on interfacial IMC formation were also discussed.

Original languageEnglish
Article number115102
JournalJournal of Applied Physics
Volume123
Issue number11
DOIs
Publication statusPublished - 2018 Mar 21

All Science Journal Classification (ASJC) codes

  • Physics and Astronomy(all)

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