Diffusion of Cu inside Sn was studied through interfacial interactions between Cu and Sn nanoparticles without using any soldering additives. The studies conducted in this research revealed that the diffusion of Cu towards Sn nanoparticles was as high as 30 nm and 84 nm, respectively, when the Cu and Sn nanoparticles were heated at 150°C and 210°C under H2/N2. The atomic flux of Cu diffusion into the Sn nanoparticles during interfacial reactions at 150°C was higher than that of the Cu diffusion into bulk Sn. High Cu flux resulted in the formation of intermetallic compounds Cu6Sn5 at 150°C and Cu6Sn5 and Cu3Sn at 210°C without an observable diffusion layer.
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Electrical and Electronic Engineering
- Materials Chemistry