Atomistic simulations of nanoindentation on Cu (111) with a void

Chung Ming Tan, Yeau Ren Jeng, Yung Chuan Chiou

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper employs static atomistic simulations to investigate the effect of a void on the nanoindentation of Cu(111). The simulations minimize the potential energy of the complete system via finite element formulation to identify the equilibrium configuration of any deformed state. The size and depth of the void are treated as two variable parameters. The numerical results reveal that the void disappears when the indentation depth is sufficiently large. A stress concentration is observed at the internal surface of the void in all simulations cases. The results indicate that the presence of a void has a significant influence on the nanohardness extracted from the nanoindentation tests.

Original languageEnglish
Title of host publicationAdvances in Fracture and Materials Behavior - Selected, peer reviewed papers of the Seventh International Conference on Fracture and Strength of Solids (FEOFS2007)
PublisherTrans Tech Publications
Pages919-924
Number of pages6
ISBN (Print)0878493999, 9780878493999
DOIs
Publication statusPublished - 2008
Event7th International Conference on Fracture and Strength of Solids, FEOFS 2007 - Urumqi, China
Duration: 2007 Aug 272007 Aug 29

Publication series

NameAdvanced Materials Research
Volume33-37 PART 2
ISSN (Print)1022-6680

Other

Other7th International Conference on Fracture and Strength of Solids, FEOFS 2007
CountryChina
CityUrumqi
Period07-08-2707-08-29

All Science Journal Classification (ASJC) codes

  • Engineering(all)

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