Atomistic Understanding of the Competition between Dislocation and Twinning in Silver under Nanoindentation

Yuan Ting Lin, Shih Chieh Hsiao, I. Ling Chang, Jui Chao Kuo

Research output: Contribution to journalArticlepeer-review

Abstract

In this study, the competition mechanisms between dislocation slip and twinning in silver with a low stacking fault energy using molecular dynamics (MD) simulation from an atomistic point of view are reported. Herein, three crystallographic surface orientations of (Formula presented.), (Formula presented.), and (Formula presented.) are considered and compared. The indentation stress–strain curves are successfully obtained from the load–displacement curves of nanoindentation. The stress of (Formula presented.), (Formula presented.), and (Formula presented.) orientations drops at the strains of 0.140, 0.133, and 0.136, which corresponds to the yield stress of 3.83, 4.33, and 4.99 GPa, respectively. Dislocation slip and twinning simultaneously form in silver as indicated by the total potential energy of the system. Furthermore, the typical four-, two-, and sixfold symmetries of the out-of-plane displacement as in copper are not observed for (Formula presented.), (Formula presented.), and (Formula presented.) orientations in silver. Hence, this observation can be supported by the simultaneous occurrence of dislocation slip and twinning in silver.

Original languageEnglish
Article number2300320
JournalAdvanced Engineering Materials
Volume25
Issue number17
DOIs
Publication statusPublished - 2023 Sept

All Science Journal Classification (ASJC) codes

  • General Materials Science
  • Condensed Matter Physics

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