Au/AuBe/Cr contact to p-ZnTe

S. J. Chang; W. R. Chen; Y. K. Su; J. F. Chen; W. H. Lan; C. I. Chiang; W. J. Lin; Y. T. Cherng; C. H. Liu

doi:10.1049/el:20010190

Au/AuBe/Cr contact to p-ZnTe

S. J. Chang, W. R. Chen, Y. K. Su, J. F. Chen, W. H. Lan, C. I. Chiang, W. J. Lin, Y. T. Cherng, C. H. Liu

Research output: Contribution to journal › Article › peer-review

4 Citations (Scopus)

Abstract

Au/AuBe and Au/AuBe/Cr contacts have been deposited onto the surface of p-ZnTe. It was found that with a proper choice of Cr thickness, a low specific contact resistance of 2.0 × 10⁶Ωcm² can be achieved for Au/AuBe/Cr on p-ZnTe. It was also found that Zn outdiffusion will significantly degrade the electrical properties of the Au/AuBe contact on p-ZnTe when annealing temperature is above 300°C. Conversely, Au/AuBe/Cr contact is more thermally reliable. Such a property makes Au/AuBe/Cr attractive in device application.

Original language	English
Pages (from-to)	321-322
Number of pages	2
Journal	Electronics Letters
Volume	37
Issue number	5
DOIs	https://doi.org/10.1049/el:20010190
Publication status	Published - 2001 Mar 1

All Science Journal Classification (ASJC) codes

Electrical and Electronic Engineering

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10.1049/el:20010190

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@article{5b0c586b47e74b52887c09f51298251b,

title = "Au/AuBe/Cr contact to p-ZnTe",

abstract = "Au/AuBe and Au/AuBe/Cr contacts have been deposited onto the surface of p-ZnTe. It was found that with a proper choice of Cr thickness, a low specific contact resistance of 2.0 × 106Ωcm2 can be achieved for Au/AuBe/Cr on p-ZnTe. It was also found that Zn outdiffusion will significantly degrade the electrical properties of the Au/AuBe contact on p-ZnTe when annealing temperature is above 300°C. Conversely, Au/AuBe/Cr contact is more thermally reliable. Such a property makes Au/AuBe/Cr attractive in device application.",

author = "Chang, {S. J.} and Chen, {W. R.} and Su, {Y. K.} and Chen, {J. F.} and Lan, {W. H.} and Chiang, {C. I.} and Lin, {W. J.} and Cherng, {Y. T.} and Liu, {C. H.}",

year = "2001",

month = mar,

day = "1",

doi = "10.1049/el:20010190",

language = "English",

volume = "37",

pages = "321--322",

journal = "Electronics Letters",

issn = "0013-5194",

publisher = "Institution of Engineering and Technology",

number = "5",

}

TY - JOUR

T1 - Au/AuBe/Cr contact to p-ZnTe

AU - Chang, S. J.

AU - Chen, W. R.

AU - Su, Y. K.

AU - Chen, J. F.

AU - Lan, W. H.

AU - Chiang, C. I.

AU - Lin, W. J.

AU - Cherng, Y. T.

AU - Liu, C. H.

PY - 2001/3/1

Y1 - 2001/3/1

N2 - Au/AuBe and Au/AuBe/Cr contacts have been deposited onto the surface of p-ZnTe. It was found that with a proper choice of Cr thickness, a low specific contact resistance of 2.0 × 106Ωcm2 can be achieved for Au/AuBe/Cr on p-ZnTe. It was also found that Zn outdiffusion will significantly degrade the electrical properties of the Au/AuBe contact on p-ZnTe when annealing temperature is above 300°C. Conversely, Au/AuBe/Cr contact is more thermally reliable. Such a property makes Au/AuBe/Cr attractive in device application.

AB - Au/AuBe and Au/AuBe/Cr contacts have been deposited onto the surface of p-ZnTe. It was found that with a proper choice of Cr thickness, a low specific contact resistance of 2.0 × 106Ωcm2 can be achieved for Au/AuBe/Cr on p-ZnTe. It was also found that Zn outdiffusion will significantly degrade the electrical properties of the Au/AuBe contact on p-ZnTe when annealing temperature is above 300°C. Conversely, Au/AuBe/Cr contact is more thermally reliable. Such a property makes Au/AuBe/Cr attractive in device application.

UR - http://www.scopus.com/inward/record.url?scp=0035279902&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0035279902&partnerID=8YFLogxK

U2 - 10.1049/el:20010190

DO - 10.1049/el:20010190

M3 - Article

AN - SCOPUS:0035279902

SN - 0013-5194

VL - 37

SP - 321

EP - 322

JO - Electronics Letters

JF - Electronics Letters

IS - 5

ER -

Au/AuBe/Cr contact to p-ZnTe

Abstract

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