Average power handling capability on SiON thin film coplanar waveguide interconnections for MMICs

Tzu Chun Tai, Hung Wei Wu, Sin Pei Wang, Cheng Yuan Hung, Wei Chen Tien, Yeong Her Wang

Research output: Contribution to journalArticle

Abstract

In this study, we investigated the average power handling capability (APHC) of silicon-oxy-nitride (SiON) thin-film-coated coplanar waveguide (CPW) interconnections for monolithic microwave integrated circuits (MMICs). SiON thin films were prepared through very-high-frequency plasma-enhanced chemical vapor deposition at 40.68 MHz. Films prepared under various annealing conditions were studied. The microwave characteristics of CPW interconnections were analyzed for fitting to the International Technology Roadmap for Semiconductors. SiON thin films were annealed under a vacuum condition for 60 s at 700 °C, 900 °C and 1100 °C. The use of coated and annealed SiON thin films on the low-resistivity Si substrate effectively improved the substrate resistivity, reduced microwave attenuation at 1100 °C, and enhanced the APHC of CPW interconnections. These results indicate that the proposed method is suitable for application to MMICs.

Original languageEnglish
Pages (from-to)15599-15607
Number of pages9
JournalJournal of Materials Science: Materials in Electronics
Volume30
Issue number16
DOIs
Publication statusPublished - 2019 Aug 30

Fingerprint

microwave circuits
Coplanar waveguides
Monolithic microwave integrated circuits
Silicon
Nitrides
nitrides
integrated circuits
waveguides
Thin films
silicon
thin films
microwave attenuation
Microwaves
very high frequencies
electrical resistivity
Substrates
Plasma enhanced chemical vapor deposition
vapor deposition
Vacuum
Annealing

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

Cite this

Tai, Tzu Chun ; Wu, Hung Wei ; Wang, Sin Pei ; Hung, Cheng Yuan ; Tien, Wei Chen ; Wang, Yeong Her. / Average power handling capability on SiON thin film coplanar waveguide interconnections for MMICs. In: Journal of Materials Science: Materials in Electronics. 2019 ; Vol. 30, No. 16. pp. 15599-15607.
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Average power handling capability on SiON thin film coplanar waveguide interconnections for MMICs. / Tai, Tzu Chun; Wu, Hung Wei; Wang, Sin Pei; Hung, Cheng Yuan; Tien, Wei Chen; Wang, Yeong Her.

In: Journal of Materials Science: Materials in Electronics, Vol. 30, No. 16, 30.08.2019, p. 15599-15607.

Research output: Contribution to journalArticle

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AU - Tai, Tzu Chun

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