Back flash imprint lithography for transparent plastic substrates

Wen Chang Liao, Steve Lien Chung Hsu, Sheng Yuan Chu, Po Ching Kau

Research output: Contribution to journalArticlepeer-review

5 Citations (Scopus)


A new and low-cost process, back flash imprint lithography (BFIL), has been developed for use in resist pattern transfer on flexible transparent plastic substrates. This technique uses a two-layer plate, which contains a transparent plastic substrate coated with an UV-curable resist. The plate is heated over the resist's softening point. Then a non-transparent mold is pressed to the resist layer. After cooling to room temperature, an UV-light is applied from the substrate side to photocure the resist. After the separation of mold and the resist layer, the desired patterns can be transferred to the resist completely.

Original languageEnglish
Pages (from-to)250-254
Number of pages5
JournalMicroelectronic Engineering
Issue number3-4
Publication statusPublished - 2005 Jul 1

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

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