A metallization process to produce a composite barrier layer on copper substrates is presented. Barrier effectiveness is tested using indium as the solder medium. Bonded samples are evaluated using scanning electron microscope (SEM) with energy dispersive X-ray (EDX).
|Number of pages||6|
|Journal||Proceedings - Electronic Components and Technology Conference|
|Publication status||Published - 2000|
All Science Journal Classification (ASJC) codes
- Electrical and Electronic Engineering