Barrier metallization technique on copper substrates for soldering applications

William W. So, Selah Choe, Wen-Kuei Chuang, Chin C. Lee

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

A metallization process to produce a composite barrier layer on copper substrates is presented. Barrier effectiveness is tested using indium as the solder medium. Bonded samples are evaluated using scanning electron microscope (SEM) with energy dispersive X-ray (EDX).

Original languageEnglish
Pages (from-to)855-860
Number of pages6
JournalProceedings - Electronic Components and Technology Conference
Publication statusPublished - 2000

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

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