Abstract
This study investigated the characteristics of the intermetallics that appear in Sn-Zn-Ag solder alloys, particularly their behavior in molten solder during cooling and remelting. The results indicated that the intermetallics, which deplete the Zn-rich phase, were present in the form of inhomogeneous dendrites and consisted of two intermetallic phases, ε-AgZn3 and γ-Ag5Zn8. These Ag-Zn intermetallics formed as the primary dendrites upon cooling from temperatures slightly below 300°C. These intermetallics transformed into coarse nodules with a stable, high Ag-content phase when isothermally heated at 250°C. These massive intermetallic particles tended to settle at the bottom of the melt due to low buoyancy. Isothermal heating at slightly above 300°C resulted in the rapid melting of these intermetallics. Subsequent quenching caused numerous fine dendritic intermetallics to form throughout the solder.
| Original language | English |
|---|---|
| Pages (from-to) | 2060-2067 |
| Number of pages | 8 |
| Journal | Journal of Materials Research |
| Volume | 18 |
| Issue number | 9 |
| DOIs | |
| Publication status | Published - 2003 Jul 1 |
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All Science Journal Classification (ASJC) codes
- Materials Science(all)
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering
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Behavior of intermetallics in liquid Sn-Zn-Ag solder alloys. / Song, Jenn Ming; Lin, Kwang-Lung.
In: Journal of Materials Research, Vol. 18, No. 9, 01.07.2003, p. 2060-2067.Research output: Contribution to journal › Article
TY - JOUR
T1 - Behavior of intermetallics in liquid Sn-Zn-Ag solder alloys
AU - Song, Jenn Ming
AU - Lin, Kwang-Lung
PY - 2003/7/1
Y1 - 2003/7/1
N2 - This study investigated the characteristics of the intermetallics that appear in Sn-Zn-Ag solder alloys, particularly their behavior in molten solder during cooling and remelting. The results indicated that the intermetallics, which deplete the Zn-rich phase, were present in the form of inhomogeneous dendrites and consisted of two intermetallic phases, ε-AgZn3 and γ-Ag5Zn8. These Ag-Zn intermetallics formed as the primary dendrites upon cooling from temperatures slightly below 300°C. These intermetallics transformed into coarse nodules with a stable, high Ag-content phase when isothermally heated at 250°C. These massive intermetallic particles tended to settle at the bottom of the melt due to low buoyancy. Isothermal heating at slightly above 300°C resulted in the rapid melting of these intermetallics. Subsequent quenching caused numerous fine dendritic intermetallics to form throughout the solder.
AB - This study investigated the characteristics of the intermetallics that appear in Sn-Zn-Ag solder alloys, particularly their behavior in molten solder during cooling and remelting. The results indicated that the intermetallics, which deplete the Zn-rich phase, were present in the form of inhomogeneous dendrites and consisted of two intermetallic phases, ε-AgZn3 and γ-Ag5Zn8. These Ag-Zn intermetallics formed as the primary dendrites upon cooling from temperatures slightly below 300°C. These intermetallics transformed into coarse nodules with a stable, high Ag-content phase when isothermally heated at 250°C. These massive intermetallic particles tended to settle at the bottom of the melt due to low buoyancy. Isothermal heating at slightly above 300°C resulted in the rapid melting of these intermetallics. Subsequent quenching caused numerous fine dendritic intermetallics to form throughout the solder.
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U2 - 10.1557/JMR.2003.0290
DO - 10.1557/JMR.2003.0290
M3 - Article
VL - 18
SP - 2060
EP - 2067
JO - Journal of Materials Research
JF - Journal of Materials Research
SN - 0884-2914
IS - 9
ER -