TY - JOUR
T1 - Behavior of intermetallics in liquid Sn-Zn-Ag solder alloys
AU - Song, Jenn Ming
AU - Lin, Kwang Lung
N1 - Funding Information:
The authors acknowledge the financial support from National Science Council of the Republic of China under Grant No. NSC 91-2216-E-006-054.
PY - 2003/7/1
Y1 - 2003/7/1
N2 - This study investigated the characteristics of the intermetallics that appear in Sn-Zn-Ag solder alloys, particularly their behavior in molten solder during cooling and remelting. The results indicated that the intermetallics, which deplete the Zn-rich phase, were present in the form of inhomogeneous dendrites and consisted of two intermetallic phases, ε-AgZn3 and γ-Ag5Zn8. These Ag-Zn intermetallics formed as the primary dendrites upon cooling from temperatures slightly below 300°C. These intermetallics transformed into coarse nodules with a stable, high Ag-content phase when isothermally heated at 250°C. These massive intermetallic particles tended to settle at the bottom of the melt due to low buoyancy. Isothermal heating at slightly above 300°C resulted in the rapid melting of these intermetallics. Subsequent quenching caused numerous fine dendritic intermetallics to form throughout the solder.
AB - This study investigated the characteristics of the intermetallics that appear in Sn-Zn-Ag solder alloys, particularly their behavior in molten solder during cooling and remelting. The results indicated that the intermetallics, which deplete the Zn-rich phase, were present in the form of inhomogeneous dendrites and consisted of two intermetallic phases, ε-AgZn3 and γ-Ag5Zn8. These Ag-Zn intermetallics formed as the primary dendrites upon cooling from temperatures slightly below 300°C. These intermetallics transformed into coarse nodules with a stable, high Ag-content phase when isothermally heated at 250°C. These massive intermetallic particles tended to settle at the bottom of the melt due to low buoyancy. Isothermal heating at slightly above 300°C resulted in the rapid melting of these intermetallics. Subsequent quenching caused numerous fine dendritic intermetallics to form throughout the solder.
UR - http://www.scopus.com/inward/record.url?scp=0141481858&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=0141481858&partnerID=8YFLogxK
U2 - 10.1557/JMR.2003.0290
DO - 10.1557/JMR.2003.0290
M3 - Article
AN - SCOPUS:0141481858
VL - 18
SP - 2060
EP - 2067
JO - Journal of Materials Research
JF - Journal of Materials Research
SN - 0884-2914
IS - 9
ER -