Behavior of intermetallics in liquid Sn-Zn-Ag solder alloys

Jenn Ming Song, Kwang-Lung Lin

Research output: Contribution to journalArticle

27 Citations (Scopus)

Abstract

This study investigated the characteristics of the intermetallics that appear in Sn-Zn-Ag solder alloys, particularly their behavior in molten solder during cooling and remelting. The results indicated that the intermetallics, which deplete the Zn-rich phase, were present in the form of inhomogeneous dendrites and consisted of two intermetallic phases, ε-AgZn3 and γ-Ag5Zn8. These Ag-Zn intermetallics formed as the primary dendrites upon cooling from temperatures slightly below 300°C. These intermetallics transformed into coarse nodules with a stable, high Ag-content phase when isothermally heated at 250°C. These massive intermetallic particles tended to settle at the bottom of the melt due to low buoyancy. Isothermal heating at slightly above 300°C resulted in the rapid melting of these intermetallics. Subsequent quenching caused numerous fine dendritic intermetallics to form throughout the solder.

Original languageEnglish
Pages (from-to)2060-2067
Number of pages8
JournalJournal of Materials Research
Volume18
Issue number9
DOIs
Publication statusPublished - 2003 Jul 1

Fingerprint

solders
Soldering alloys
Intermetallics
intermetallics
Liquids
liquids
Dendrites (metallography)
dendrites
melting
Cooling
cooling
Remelting
nodules
Buoyancy
buoyancy
Molten materials
Quenching
Melting
quenching
Heating

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

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Behavior of intermetallics in liquid Sn-Zn-Ag solder alloys. / Song, Jenn Ming; Lin, Kwang-Lung.

In: Journal of Materials Research, Vol. 18, No. 9, 01.07.2003, p. 2060-2067.

Research output: Contribution to journalArticle

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