TY - JOUR
T1 - Benefit model of virtual metrology and integrating AVM into MES
AU - Cheng, Fan Tien
AU - Chang, Jonathan Yung Cheng
AU - Huang, Hsien Cheng
AU - Kao, Chi An
AU - Chen, Ying Lin
AU - Peng, Ju Lei
N1 - Funding Information:
Manuscript received March 23, 2010; revised August 19, 2010, November 15, 2010, and December 17, 2010; accepted December 17, 2010. Date of publication January 6, 2011; date of current version May 4, 2011. This work was supported by the National Science Council of the Republic of China and Foresight Technology, Ltd., under Project 982C06, and by the Landmark Project of National Cheng Kung University, Taiwan. This work includes Taiwan, USA, and China patents pending with applications 99111473, 12/784,428, and 201010189443.1, respectively.
PY - 2011/5
Y1 - 2011/5
N2 - Frequent monitoring in both tool and process is required to detect the quality issue early so as to improve the process stability of semiconductor manufacturing. However, more tool and process monitoring means more metrology operation cost and longer cycle time. Recently, a promising technology denoted virtual metrology (VM) has bloomed. VM can convert sampling inspection with metrology delay into real-time and on-line total inspection. Therefore, VM has now been designated by International SEMATECH Manufacturing Initiative and International Technology Road Map for Semiconductors as one of the focus areas for the next generation factory realization road map of the semiconductor industry. The authors have developed the so-called automatic virtual metrology (AVM) system to implement and deploy the VM operations automatically. The purpose of this paper is to develop a business model to measure the profitability of VM based on in-depth manufacturing practices and metrology operations required for semiconductor manufacturing. This paper also proposes a novel manufacturing system that integrates AVM into the manufacturing execution system (MES). The interfaces among AVM, other MES components, and run-to-run (R2R) modules in the novel manufacturing system are also defined such that the total quality inspection system can be achieved and the R2R capability can be migrated from lot-to-lot control to wafer-to-wafer control.
AB - Frequent monitoring in both tool and process is required to detect the quality issue early so as to improve the process stability of semiconductor manufacturing. However, more tool and process monitoring means more metrology operation cost and longer cycle time. Recently, a promising technology denoted virtual metrology (VM) has bloomed. VM can convert sampling inspection with metrology delay into real-time and on-line total inspection. Therefore, VM has now been designated by International SEMATECH Manufacturing Initiative and International Technology Road Map for Semiconductors as one of the focus areas for the next generation factory realization road map of the semiconductor industry. The authors have developed the so-called automatic virtual metrology (AVM) system to implement and deploy the VM operations automatically. The purpose of this paper is to develop a business model to measure the profitability of VM based on in-depth manufacturing practices and metrology operations required for semiconductor manufacturing. This paper also proposes a novel manufacturing system that integrates AVM into the manufacturing execution system (MES). The interfaces among AVM, other MES components, and run-to-run (R2R) modules in the novel manufacturing system are also defined such that the total quality inspection system can be achieved and the R2R capability can be migrated from lot-to-lot control to wafer-to-wafer control.
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U2 - 10.1109/TSM.2011.2104372
DO - 10.1109/TSM.2011.2104372
M3 - Article
AN - SCOPUS:79955659976
SN - 0894-6507
VL - 24
SP - 261
EP - 272
JO - IEEE Transactions on Semiconductor Manufacturing
JF - IEEE Transactions on Semiconductor Manufacturing
IS - 2
M1 - 5682063
ER -