Board-level reliability of coreless flip chip package assembled on a printed circuit board

Tao Chih Chang, Jin Ye Juang, Hung Jen Chang, Chun Chih Chuang, Chau Jie Zhan, Yin Po Hung, Tsung Fu Yang, Wei Li, Su Ching Chung, Jung Hua Chou

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

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Engineering & Materials Science

Chemical Compounds