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Board-level reliability of coreless flip chip package assembled on a printed circuit board
Tao Chih Chang, Jin Ye Juang, Hung Jen Chang, Chun Chih Chuang, Chau Jie Zhan, Yin Po Hung, Tsung Fu Yang, Wei Li, Su Ching Chung, Jung Hua Chou
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
2
Citations
(Scopus)