Bonding and failure behaviors of ACA flip chip bumps

Kwang Lung Lin, Wei Liang Chen, Charles Hwang

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

An anisotropic conductive adhesive (ACA) bump was produced on a silicon chip for bonding onto a glass substrate. The bumping process and the bonding procedure are described. The constituents of the ACA were investigated with a scanning electron microscope (SEM) and energy dispersive spectroscopy (EDS). The thermal behavior of the ACA was investigated with differential scanning calorimetry (DSC). The spherical conductive nickel particles were deformed after bonding, while the silica filler was not. The reliability of the ACA bonding was tested at 85'C/85% relative humidity. The failure behavior of the ACA bonding was further investigated. A suitable height of the metal bonding pad was recommended.

Original languageEnglish
Pages (from-to)119-131
Number of pages13
JournalInternational Journal of Microcircuits and Electronic Packaging
Volume25
Issue number1
Publication statusPublished - 2005 Dec 1

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Safety, Risk, Reliability and Quality
  • Electrical and Electronic Engineering

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