Bonding fracture mechanism between Sn-Pb solder and electroless nickel-alloy deposits

Chwan Ying Lee, Kwang Lung Lin

Research output: Contribution to conferencePaper

2 Citations (Scopus)

Abstract

The present study investigated the fracture mechanism of solder bumps consisting of Al/electroless Ni alloy/Sn-Pb combination. The intermetallic compounds formed at the interface were Ni3Sn4 at 150 °C, and Ni3Sn2 and Ni3Sn4 phases formed at 250 °C for all electroless nickel-alloy deposits. Experimental results showed that the adhesion strength of the above bump is lowered at longer soldering time and higher temperature. On the basis of the observation of the fracture surface, the fracture modes were classified into three types. The type I fracture takes place at the bulk solder which occurred when the sample was soldered at 250 °C for less than 30 seconds. The second type of fracture occurred within the intermetallic compound layer when the sample was soldered at 250 °C for 5 minutes or heat treated at 150 °C for 1000 hours. The type III fracture occurred at the Ni-Cu-P/Al interface when soldered at 300 °C for 20 minutes.

Original languageEnglish
Pages1081-1099
Number of pages19
Publication statusPublished - 1995 Jan 1
EventProceedings of the International Intersociety Electronic Packaging Conference - INTERpack'95. Part 1 (of 2) - Maui, HI, USA
Duration: 1995 Mar 261995 Mar 30

Other

OtherProceedings of the International Intersociety Electronic Packaging Conference - INTERpack'95. Part 1 (of 2)
CityMaui, HI, USA
Period95-03-2695-03-30

Fingerprint

Nickel alloys
Soldering alloys
Deposits
Intermetallics
Bond strength (materials)
Soldering

All Science Journal Classification (ASJC) codes

  • Mechanical Engineering
  • Electrical and Electronic Engineering

Cite this

Lee, C. Y., & Lin, K. L. (1995). Bonding fracture mechanism between Sn-Pb solder and electroless nickel-alloy deposits. 1081-1099. Paper presented at Proceedings of the International Intersociety Electronic Packaging Conference - INTERpack'95. Part 1 (of 2), Maui, HI, USA, .
Lee, Chwan Ying ; Lin, Kwang Lung. / Bonding fracture mechanism between Sn-Pb solder and electroless nickel-alloy deposits. Paper presented at Proceedings of the International Intersociety Electronic Packaging Conference - INTERpack'95. Part 1 (of 2), Maui, HI, USA, .19 p.
@conference{ab35b5a49b8f419f9f6d731a16821474,
title = "Bonding fracture mechanism between Sn-Pb solder and electroless nickel-alloy deposits",
abstract = "The present study investigated the fracture mechanism of solder bumps consisting of Al/electroless Ni alloy/Sn-Pb combination. The intermetallic compounds formed at the interface were Ni3Sn4 at 150 °C, and Ni3Sn2 and Ni3Sn4 phases formed at 250 °C for all electroless nickel-alloy deposits. Experimental results showed that the adhesion strength of the above bump is lowered at longer soldering time and higher temperature. On the basis of the observation of the fracture surface, the fracture modes were classified into three types. The type I fracture takes place at the bulk solder which occurred when the sample was soldered at 250 °C for less than 30 seconds. The second type of fracture occurred within the intermetallic compound layer when the sample was soldered at 250 °C for 5 minutes or heat treated at 150 °C for 1000 hours. The type III fracture occurred at the Ni-Cu-P/Al interface when soldered at 300 °C for 20 minutes.",
author = "Lee, {Chwan Ying} and Lin, {Kwang Lung}",
year = "1995",
month = "1",
day = "1",
language = "English",
pages = "1081--1099",
note = "Proceedings of the International Intersociety Electronic Packaging Conference - INTERpack'95. Part 1 (of 2) ; Conference date: 26-03-1995 Through 30-03-1995",

}

Lee, CY & Lin, KL 1995, 'Bonding fracture mechanism between Sn-Pb solder and electroless nickel-alloy deposits', Paper presented at Proceedings of the International Intersociety Electronic Packaging Conference - INTERpack'95. Part 1 (of 2), Maui, HI, USA, 95-03-26 - 95-03-30 pp. 1081-1099.

Bonding fracture mechanism between Sn-Pb solder and electroless nickel-alloy deposits. / Lee, Chwan Ying; Lin, Kwang Lung.

1995. 1081-1099 Paper presented at Proceedings of the International Intersociety Electronic Packaging Conference - INTERpack'95. Part 1 (of 2), Maui, HI, USA, .

Research output: Contribution to conferencePaper

TY - CONF

T1 - Bonding fracture mechanism between Sn-Pb solder and electroless nickel-alloy deposits

AU - Lee, Chwan Ying

AU - Lin, Kwang Lung

PY - 1995/1/1

Y1 - 1995/1/1

N2 - The present study investigated the fracture mechanism of solder bumps consisting of Al/electroless Ni alloy/Sn-Pb combination. The intermetallic compounds formed at the interface were Ni3Sn4 at 150 °C, and Ni3Sn2 and Ni3Sn4 phases formed at 250 °C for all electroless nickel-alloy deposits. Experimental results showed that the adhesion strength of the above bump is lowered at longer soldering time and higher temperature. On the basis of the observation of the fracture surface, the fracture modes were classified into three types. The type I fracture takes place at the bulk solder which occurred when the sample was soldered at 250 °C for less than 30 seconds. The second type of fracture occurred within the intermetallic compound layer when the sample was soldered at 250 °C for 5 minutes or heat treated at 150 °C for 1000 hours. The type III fracture occurred at the Ni-Cu-P/Al interface when soldered at 300 °C for 20 minutes.

AB - The present study investigated the fracture mechanism of solder bumps consisting of Al/electroless Ni alloy/Sn-Pb combination. The intermetallic compounds formed at the interface were Ni3Sn4 at 150 °C, and Ni3Sn2 and Ni3Sn4 phases formed at 250 °C for all electroless nickel-alloy deposits. Experimental results showed that the adhesion strength of the above bump is lowered at longer soldering time and higher temperature. On the basis of the observation of the fracture surface, the fracture modes were classified into three types. The type I fracture takes place at the bulk solder which occurred when the sample was soldered at 250 °C for less than 30 seconds. The second type of fracture occurred within the intermetallic compound layer when the sample was soldered at 250 °C for 5 minutes or heat treated at 150 °C for 1000 hours. The type III fracture occurred at the Ni-Cu-P/Al interface when soldered at 300 °C for 20 minutes.

UR - http://www.scopus.com/inward/record.url?scp=0029231809&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0029231809&partnerID=8YFLogxK

M3 - Paper

AN - SCOPUS:0029231809

SP - 1081

EP - 1099

ER -

Lee CY, Lin KL. Bonding fracture mechanism between Sn-Pb solder and electroless nickel-alloy deposits. 1995. Paper presented at Proceedings of the International Intersociety Electronic Packaging Conference - INTERpack'95. Part 1 (of 2), Maui, HI, USA, .