BSIM-IMG: A Turnkey compact model for fully depleted technologies

Chenming Hu, Ali Niknejad, V. Sriramkumar, Darsen Lu, Yogesh Chauhan, Muhammed Kahm, Angada Sachid

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Citations (Scopus)

Abstract

BSIM-IMG is a Turnkey, Production Ready model Will be submitted to the CMC for standardization Physical, Scalable Core Model for FDSOI devices Plethora of Real Device Effects modeled Advanced Device Effects-Quantum, Back-gate bias, Self-heating Validated on Hardware Data from two FDSOI/UTBSOI technologies Available in major EDA tools.

Original languageEnglish
Title of host publication2012 IEEE International SOI Conference, SOI 2012
DOIs
Publication statusPublished - 2012 Dec 1
Event2012 IEEE International SOI Conference, SOI 2012 - Napa, CA, United States
Duration: 2012 Oct 1 → 2012 Oct 4

Publication series

NameProceedings - IEEE International SOI Conference
ISSN (Print)1078-621X

Other

Other2012 IEEE International SOI Conference, SOI 2012
CountryUnited States
CityNapa, CA
Period12-10-01 → 12-10-04

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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    Hu, C., Niknejad, A., Sriramkumar, V., Lu, D., Chauhan, Y., Kahm, M., & Sachid, A. (2012). BSIM-IMG: A Turnkey compact model for fully depleted technologies. In 2012 IEEE International SOI Conference, SOI 2012 [6404352] (Proceedings - IEEE International SOI Conference). https://doi.org/10.1109/SOI.2012.6404352