TY - GEN
T1 - BSIM-IMG
T2 - 2012 IEEE International SOI Conference, SOI 2012
AU - Hu, Chenming
AU - Niknejad, Ali
AU - Sriramkumar, V.
AU - Lu, Darsen
AU - Chauhan, Yogesh
AU - Kahm, Muhammed
AU - Sachid, Angada
PY - 2012
Y1 - 2012
N2 - BSIM-IMG is a Turnkey, Production Ready model Will be submitted to the CMC for standardization Physical, Scalable Core Model for FDSOI devices Plethora of Real Device Effects modeled Advanced Device Effects-Quantum, Back-gate bias, Self-heating Validated on Hardware Data from two FDSOI/UTBSOI technologies Available in major EDA tools.
AB - BSIM-IMG is a Turnkey, Production Ready model Will be submitted to the CMC for standardization Physical, Scalable Core Model for FDSOI devices Plethora of Real Device Effects modeled Advanced Device Effects-Quantum, Back-gate bias, Self-heating Validated on Hardware Data from two FDSOI/UTBSOI technologies Available in major EDA tools.
UR - http://www.scopus.com/inward/record.url?scp=84873549776&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84873549776&partnerID=8YFLogxK
U2 - 10.1109/SOI.2012.6404352
DO - 10.1109/SOI.2012.6404352
M3 - Conference contribution
AN - SCOPUS:84873549776
SN - 9781467326919
T3 - Proceedings - IEEE International SOI Conference
BT - 2012 IEEE International SOI Conference, SOI 2012
Y2 - 1 October 2012 through 4 October 2012
ER -