BSIM-IMG: A Turnkey compact model for fully depleted technologies

Chenming Hu; Ali Niknejad; V. Sriramkumar; Darsen Lu; Yogesh Chauhan; Muhammed Kahm; Angada Sachid

doi:10.1109/SOI.2012.6404352

BSIM-IMG: A Turnkey compact model for fully depleted technologies

Chenming Hu
, Ali Niknejad
, V. Sriramkumar
, Darsen Lu
, Yogesh Chauhan
, Muhammed Kahm
, Angada Sachid

Institute of Microelectronics

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

8 Citations (Scopus)

Abstract

BSIM-IMG is a Turnkey, Production Ready model Will be submitted to the CMC for standardization Physical, Scalable Core Model for FDSOI devices Plethora of Real Device Effects modeled Advanced Device Effects-Quantum, Back-gate bias, Self-heating Validated on Hardware Data from two FDSOI/UTBSOI technologies Available in major EDA tools.

Original language	English
Title of host publication	2012 IEEE International SOI Conference, SOI 2012
DOIs	https://doi.org/10.1109/SOI.2012.6404352
Publication status	Published - 2012
Event	2012 IEEE International SOI Conference, SOI 2012 - Napa, CA, United States Duration: 2012 Oct 1 → 2012 Oct 4

Publication series

Name	Proceedings - IEEE International SOI Conference
ISSN (Print)	1078-621X

Other

Other	2012 IEEE International SOI Conference, SOI 2012
Country/Territory	United States
City	Napa, CA
Period	12-10-01 → 12-10-04

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

Access to Document

10.1109/SOI.2012.6404352

Cite this

@inproceedings{dc25dab57a5f407e9900a9b4a7084d71,

title = "BSIM-IMG: A Turnkey compact model for fully depleted technologies",

abstract = "BSIM-IMG is a Turnkey, Production Ready model Will be submitted to the CMC for standardization Physical, Scalable Core Model for FDSOI devices Plethora of Real Device Effects modeled Advanced Device Effects-Quantum, Back-gate bias, Self-heating Validated on Hardware Data from two FDSOI/UTBSOI technologies Available in major EDA tools.",

author = "Chenming Hu and Ali Niknejad and V. Sriramkumar and Darsen Lu and Yogesh Chauhan and Muhammed Kahm and Angada Sachid",

year = "2012",

doi = "10.1109/SOI.2012.6404352",

language = "English",

isbn = "9781467326919",

series = "Proceedings - IEEE International SOI Conference",

booktitle = "2012 IEEE International SOI Conference, SOI 2012",

note = "2012 IEEE International SOI Conference, SOI 2012 ; Conference date: 01-10-2012 Through 04-10-2012",

}

Hu, C, Niknejad, A, Sriramkumar, V, Lu, D, Chauhan, Y, Kahm, M & Sachid, A 2012, BSIM-IMG: A Turnkey compact model for fully depleted technologies. in 2012 IEEE International SOI Conference, SOI 2012., 6404352, Proceedings - IEEE International SOI Conference, 2012 IEEE International SOI Conference, SOI 2012, Napa, CA, United States, 12-10-01. https://doi.org/10.1109/SOI.2012.6404352

TY - GEN

T1 - BSIM-IMG

T2 - 2012 IEEE International SOI Conference, SOI 2012

AU - Hu, Chenming

AU - Niknejad, Ali

AU - Sriramkumar, V.

AU - Lu, Darsen

AU - Chauhan, Yogesh

AU - Kahm, Muhammed

AU - Sachid, Angada

PY - 2012

Y1 - 2012

N2 - BSIM-IMG is a Turnkey, Production Ready model Will be submitted to the CMC for standardization Physical, Scalable Core Model for FDSOI devices Plethora of Real Device Effects modeled Advanced Device Effects-Quantum, Back-gate bias, Self-heating Validated on Hardware Data from two FDSOI/UTBSOI technologies Available in major EDA tools.

AB - BSIM-IMG is a Turnkey, Production Ready model Will be submitted to the CMC for standardization Physical, Scalable Core Model for FDSOI devices Plethora of Real Device Effects modeled Advanced Device Effects-Quantum, Back-gate bias, Self-heating Validated on Hardware Data from two FDSOI/UTBSOI technologies Available in major EDA tools.

UR - https://www.scopus.com/pages/publications/84873549776

UR - https://www.scopus.com/pages/publications/84873549776#tab=citedBy

U2 - 10.1109/SOI.2012.6404352

DO - 10.1109/SOI.2012.6404352

M3 - Conference contribution

AN - SCOPUS:84873549776

SN - 9781467326919

T3 - Proceedings - IEEE International SOI Conference

BT - 2012 IEEE International SOI Conference, SOI 2012

Y2 - 1 October 2012 through 4 October 2012

ER -

BSIM-IMG: A Turnkey compact model for fully depleted technologies

Abstract

Publication series

Other

All Science Journal Classification (ASJC) codes

Access to Document

Other files and links

Fingerprint

Cite this