BUCKLING OF A BIMODULUS COMPOSITE THICK PLATE.

Lien-Wen Chen, J. L. Doong

Research output: Contribution to conferencePaper

3 Citations (Scopus)
Original languageEnglish
Pages195-200
Number of pages6
Publication statusPublished - 1983 Dec 1

Fingerprint

Buckling
Composite materials

All Science Journal Classification (ASJC) codes

  • Engineering(all)

Cite this

@conference{682b0e817e324587bdcd04b63c2f6218,
title = "BUCKLING OF A BIMODULUS COMPOSITE THICK PLATE.",
author = "Lien-Wen Chen and Doong, {J. L.}",
year = "1983",
month = "12",
day = "1",
language = "English",
pages = "195--200",

}

BUCKLING OF A BIMODULUS COMPOSITE THICK PLATE. / Chen, Lien-Wen; Doong, J. L.

1983. 195-200.

Research output: Contribution to conferencePaper

TY - CONF

T1 - BUCKLING OF A BIMODULUS COMPOSITE THICK PLATE.

AU - Chen, Lien-Wen

AU - Doong, J. L.

PY - 1983/12/1

Y1 - 1983/12/1

UR - http://www.scopus.com/inward/record.url?scp=0020877408&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0020877408&partnerID=8YFLogxK

M3 - Paper

SP - 195

EP - 200

ER -