Building materials effects of al content and physical properties on the electromagnetic interference shielding of sn based coating thin layers

Fei Shuo Hung, Fei Yi Hung, Che Ming Chiang, Truan Sheng Lui

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

This study coats complex colloid mixed with Sn-xAl powders and polyethylene on glass to examine the shield effect on electromagnetic interference (EMI). In addition, the sputtering specimens and powder coating specimens were compared. The results show that adding Al to the Sn-xAl powders can increase the electromagnetic interference (EMI) shield at lower frequencies. Notably, the number of cavities in the coating layer increased with the coating thickness, with the result that the EMI shield could not improve with an increase in the coating thickness at higher frequencies. However, the EMI shield of sputtering films had a tendency to increase as the thin thickness increased. The Sn-40Al undergoes a dispersing effect which forms a fine overlapping structure, thereby improving the low frequency EMI shielding. In addition, the Sn-20Al powders possessed the properties of a small particle size, closed structure and higher electric conductivity which improved the high frequency EMI shielding. For the sputtering films, the annealed treatment not only had higher electric conductivity but also increased the high frequency EMI shielding.

Original languageEnglish
Title of host publicationIntelligent Materials, Applied Mechanics and Design Science, IMAMD2011
Pages142-151
Number of pages10
Edition3
DOIs
Publication statusPublished - 2012
Event2011 International Conference on Intelligent Materials, Applied Mechanics and Design Science, IMAMD2011 - Beijing, China
Duration: 2011 Dec 242011 Dec 25

Publication series

NameApplied Mechanics and Materials
Number3
Volume142
ISSN (Print)1660-9336
ISSN (Electronic)1662-7482

Other

Other2011 International Conference on Intelligent Materials, Applied Mechanics and Design Science, IMAMD2011
CountryChina
CityBeijing
Period11-12-2411-12-25

All Science Journal Classification (ASJC) codes

  • Engineering(all)

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