Built-in self-forming, built-in self-test, and built-in self-repair for RRAM yield improvement

Cheng-Wen Wu, C.-Y. Chen, H.-C. Shih, M. Lee, C.-H. Lin, S.-S. Sheu

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Cite this

@inproceedings{ac4fca96f68b4e4092f6f03be957cde7,

title = "Built-in self-forming, built-in self-test, and built-in self-repair for RRAM yield improvement",

author = "Cheng-Wen Wu and C.-Y. Chen and H.-C. Shih and M. Lee and C.-H. Lin and S.-S. Sheu",

year = "2011",

month = jul,

language = "English",

booktitle = "VLSI Test Tech. Workshop (VTTW)",

}