Built-in self-forming, built-in self-test, and built-in self-repair for RRAM yield improvement

Cheng-Wen Wu, C.-Y. Chen, H.-C. Shih, M. Lee, C.-H. Lin, S.-S. Sheu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Original languageEnglish
Title of host publicationVLSI Test Tech. Workshop (VTTW)
Place of PublicationNantou
Publication statusPublished - 2011 Jul

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