Characteristic evaluation of silicon-based MEMS acoustic/acceleration sensor

Ru-Min Chao, Sie Yu Li, Chih Chao Hsu, Steven Y. Liang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Due to its smallness in size and economic-saving in batch fabrication, the acoustic micro sensor shows many potential applications in the field of manufacturing and machining monitoring system if it can help to pick up information of sound and vibration signals at specific range. In this paper, brief discussion for the design of the micro-sensor and its fabrication issue will be made. Fundamental frequency testing results by the piezo-electric shaker and acoustic measurement within the water tank are given. A 6-inch silicon wafer fabrication process and sensor design having resonant frequency in the range of 20k-60k Hz are presented and discussed. By selecting appropriate thickness of the structure layer on a SOI wafer, it is possible to customer-make a microsensor to sense within a given-range of interest and to apply it in a manufacturing monitoring system.

Original languageEnglish
Title of host publicationAmerican Society of Mechanical Engineers
Pages389-394
Number of pages6
DOIs
Publication statusPublished - 2007 Dec 28
Event2007 ASME International Conference on Manufacturing Science and Engineering - Atlanta, GA, United States
Duration: 2007 Jan 152007 Oct 18

Publication series

NameProceedings of the ASME International Manufacturing Science and Engineering Conference 2007, MSEC2007

Other

Other2007 ASME International Conference on Manufacturing Science and Engineering
CountryUnited States
CityAtlanta, GA
Period07-01-1507-10-18

Fingerprint

MEMS
Acoustics
Fabrication
Silicon
Sensors
Microsensors
Water tanks
Monitoring
Silicon wafers
Vibrations (mechanical)
Natural frequencies
Machining
Acoustic waves
Economics
Testing

All Science Journal Classification (ASJC) codes

  • Industrial and Manufacturing Engineering

Cite this

Chao, R-M., Li, S. Y., Hsu, C. C., & Liang, S. Y. (2007). Characteristic evaluation of silicon-based MEMS acoustic/acceleration sensor. In American Society of Mechanical Engineers (pp. 389-394). (Proceedings of the ASME International Manufacturing Science and Engineering Conference 2007, MSEC2007). https://doi.org/10.1115/MSEC2007-31131
Chao, Ru-Min ; Li, Sie Yu ; Hsu, Chih Chao ; Liang, Steven Y. / Characteristic evaluation of silicon-based MEMS acoustic/acceleration sensor. American Society of Mechanical Engineers. 2007. pp. 389-394 (Proceedings of the ASME International Manufacturing Science and Engineering Conference 2007, MSEC2007).
@inproceedings{6200290287894c9a97b8ac354e492a43,
title = "Characteristic evaluation of silicon-based MEMS acoustic/acceleration sensor",
abstract = "Due to its smallness in size and economic-saving in batch fabrication, the acoustic micro sensor shows many potential applications in the field of manufacturing and machining monitoring system if it can help to pick up information of sound and vibration signals at specific range. In this paper, brief discussion for the design of the micro-sensor and its fabrication issue will be made. Fundamental frequency testing results by the piezo-electric shaker and acoustic measurement within the water tank are given. A 6-inch silicon wafer fabrication process and sensor design having resonant frequency in the range of 20k-60k Hz are presented and discussed. By selecting appropriate thickness of the structure layer on a SOI wafer, it is possible to customer-make a microsensor to sense within a given-range of interest and to apply it in a manufacturing monitoring system.",
author = "Ru-Min Chao and Li, {Sie Yu} and Hsu, {Chih Chao} and Liang, {Steven Y.}",
year = "2007",
month = "12",
day = "28",
doi = "10.1115/MSEC2007-31131",
language = "English",
isbn = "0791842908",
series = "Proceedings of the ASME International Manufacturing Science and Engineering Conference 2007, MSEC2007",
pages = "389--394",
booktitle = "American Society of Mechanical Engineers",

}

Chao, R-M, Li, SY, Hsu, CC & Liang, SY 2007, Characteristic evaluation of silicon-based MEMS acoustic/acceleration sensor. in American Society of Mechanical Engineers. Proceedings of the ASME International Manufacturing Science and Engineering Conference 2007, MSEC2007, pp. 389-394, 2007 ASME International Conference on Manufacturing Science and Engineering, Atlanta, GA, United States, 07-01-15. https://doi.org/10.1115/MSEC2007-31131

Characteristic evaluation of silicon-based MEMS acoustic/acceleration sensor. / Chao, Ru-Min; Li, Sie Yu; Hsu, Chih Chao; Liang, Steven Y.

American Society of Mechanical Engineers. 2007. p. 389-394 (Proceedings of the ASME International Manufacturing Science and Engineering Conference 2007, MSEC2007).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

TY - GEN

T1 - Characteristic evaluation of silicon-based MEMS acoustic/acceleration sensor

AU - Chao, Ru-Min

AU - Li, Sie Yu

AU - Hsu, Chih Chao

AU - Liang, Steven Y.

PY - 2007/12/28

Y1 - 2007/12/28

N2 - Due to its smallness in size and economic-saving in batch fabrication, the acoustic micro sensor shows many potential applications in the field of manufacturing and machining monitoring system if it can help to pick up information of sound and vibration signals at specific range. In this paper, brief discussion for the design of the micro-sensor and its fabrication issue will be made. Fundamental frequency testing results by the piezo-electric shaker and acoustic measurement within the water tank are given. A 6-inch silicon wafer fabrication process and sensor design having resonant frequency in the range of 20k-60k Hz are presented and discussed. By selecting appropriate thickness of the structure layer on a SOI wafer, it is possible to customer-make a microsensor to sense within a given-range of interest and to apply it in a manufacturing monitoring system.

AB - Due to its smallness in size and economic-saving in batch fabrication, the acoustic micro sensor shows many potential applications in the field of manufacturing and machining monitoring system if it can help to pick up information of sound and vibration signals at specific range. In this paper, brief discussion for the design of the micro-sensor and its fabrication issue will be made. Fundamental frequency testing results by the piezo-electric shaker and acoustic measurement within the water tank are given. A 6-inch silicon wafer fabrication process and sensor design having resonant frequency in the range of 20k-60k Hz are presented and discussed. By selecting appropriate thickness of the structure layer on a SOI wafer, it is possible to customer-make a microsensor to sense within a given-range of interest and to apply it in a manufacturing monitoring system.

UR - http://www.scopus.com/inward/record.url?scp=37349124614&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=37349124614&partnerID=8YFLogxK

U2 - 10.1115/MSEC2007-31131

DO - 10.1115/MSEC2007-31131

M3 - Conference contribution

AN - SCOPUS:37349124614

SN - 0791842908

SN - 9780791842904

T3 - Proceedings of the ASME International Manufacturing Science and Engineering Conference 2007, MSEC2007

SP - 389

EP - 394

BT - American Society of Mechanical Engineers

ER -

Chao R-M, Li SY, Hsu CC, Liang SY. Characteristic evaluation of silicon-based MEMS acoustic/acceleration sensor. In American Society of Mechanical Engineers. 2007. p. 389-394. (Proceedings of the ASME International Manufacturing Science and Engineering Conference 2007, MSEC2007). https://doi.org/10.1115/MSEC2007-31131