Characteristic evaluation of silicon-based MEMS acoustic/acceleration sensor

Ru Min Chao, Sie Yu Li, Chih Chao Hsu, Steven Y. Liang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Due to its smallness in size and economic-saving in batch fabrication, the acoustic micro sensor shows many potential applications in the field of manufacturing and machining monitoring system if it can help to pick up information of sound and vibration signals at specific range. In this paper, brief discussion for the design of the micro-sensor and its fabrication issue will be made. Fundamental frequency testing results by the piezo-electric shaker and acoustic measurement within the water tank are given. A 6-inch silicon wafer fabrication process and sensor design having resonant frequency in the range of 20k-60k Hz are presented and discussed. By selecting appropriate thickness of the structure layer on a SOI wafer, it is possible to customer-make a microsensor to sense within a given-range of interest and to apply it in a manufacturing monitoring system.

Original languageEnglish
Title of host publicationAmerican Society of Mechanical Engineers
Pages389-394
Number of pages6
DOIs
Publication statusPublished - 2007
Event2007 ASME International Conference on Manufacturing Science and Engineering - Atlanta, GA, United States
Duration: 2007 Jan 152007 Oct 18

Publication series

NameProceedings of the ASME International Manufacturing Science and Engineering Conference 2007, MSEC2007

Other

Other2007 ASME International Conference on Manufacturing Science and Engineering
Country/TerritoryUnited States
CityAtlanta, GA
Period07-01-1507-10-18

All Science Journal Classification (ASJC) codes

  • Industrial and Manufacturing Engineering

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