Characteristic evaluation of silicon-based MEMS acoustic/acceleration sensor

Ru Min Chao; Sie Yu Li; Chih Chao Hsu; Steven Y. Liang

doi:10.1115/MSEC2007-31131

Characteristic evaluation of silicon-based MEMS acoustic/acceleration sensor

Ru Min Chao
, Sie Yu Li
, Chih Chao Hsu
, Steven Y. Liang

Department of Systems and Naval Mechatronic Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

Due to its smallness in size and economic-saving in batch fabrication, the acoustic micro sensor shows many potential applications in the field of manufacturing and machining monitoring system if it can help to pick up information of sound and vibration signals at specific range. In this paper, brief discussion for the design of the micro-sensor and its fabrication issue will be made. Fundamental frequency testing results by the piezo-electric shaker and acoustic measurement within the water tank are given. A 6-inch silicon wafer fabrication process and sensor design having resonant frequency in the range of 20k-60k Hz are presented and discussed. By selecting appropriate thickness of the structure layer on a SOI wafer, it is possible to customer-make a microsensor to sense within a given-range of interest and to apply it in a manufacturing monitoring system.

Original language	English
Title of host publication	American Society of Mechanical Engineers
Pages	389-394
Number of pages	6
DOIs	https://doi.org/10.1115/MSEC2007-31131
Publication status	Published - 2007
Event	2007 ASME International Conference on Manufacturing Science and Engineering - Atlanta, GA, United States Duration: 2007 Jan 15 → 2007 Oct 18

Publication series

Name	Proceedings of the ASME International Manufacturing Science and Engineering Conference 2007, MSEC2007

Other

Other	2007 ASME International Conference on Manufacturing Science and Engineering
Country/Territory	United States
City	Atlanta, GA
Period	07-01-15 → 07-10-18

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 9 Industry, Innovation, and Infrastructure

All Science Journal Classification (ASJC) codes

Industrial and Manufacturing Engineering

Access to Document

10.1115/MSEC2007-31131

Cite this

@inproceedings{6200290287894c9a97b8ac354e492a43,

title = "Characteristic evaluation of silicon-based MEMS acoustic/acceleration sensor",

abstract = "Due to its smallness in size and economic-saving in batch fabrication, the acoustic micro sensor shows many potential applications in the field of manufacturing and machining monitoring system if it can help to pick up information of sound and vibration signals at specific range. In this paper, brief discussion for the design of the micro-sensor and its fabrication issue will be made. Fundamental frequency testing results by the piezo-electric shaker and acoustic measurement within the water tank are given. A 6-inch silicon wafer fabrication process and sensor design having resonant frequency in the range of 20k-60k Hz are presented and discussed. By selecting appropriate thickness of the structure layer on a SOI wafer, it is possible to customer-make a microsensor to sense within a given-range of interest and to apply it in a manufacturing monitoring system.",

author = "Chao, \{Ru Min\} and Li, \{Sie Yu\} and Hsu, \{Chih Chao\} and Liang, \{Steven Y.\}",

year = "2007",

doi = "10.1115/MSEC2007-31131",

language = "English",

isbn = "0791842908",

series = "Proceedings of the ASME International Manufacturing Science and Engineering Conference 2007, MSEC2007",

pages = "389--394",

booktitle = "American Society of Mechanical Engineers",

note = "2007 ASME International Conference on Manufacturing Science and Engineering ; Conference date: 15-01-2007 Through 18-10-2007",

}

Chao, RM, Li, SY, Hsu, CC & Liang, SY 2007, Characteristic evaluation of silicon-based MEMS acoustic/acceleration sensor. in American Society of Mechanical Engineers. Proceedings of the ASME International Manufacturing Science and Engineering Conference 2007, MSEC2007, pp. 389-394, 2007 ASME International Conference on Manufacturing Science and Engineering, Atlanta, GA, United States, 07-01-15. https://doi.org/10.1115/MSEC2007-31131

Characteristic evaluation of silicon-based MEMS acoustic/acceleration sensor. / Chao, Ru Min; Li, Sie Yu; Hsu, Chih Chao et al.
American Society of Mechanical Engineers. 2007. p. 389-394 (Proceedings of the ASME International Manufacturing Science and Engineering Conference 2007, MSEC2007).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Characteristic evaluation of silicon-based MEMS acoustic/acceleration sensor

AU - Chao, Ru Min

AU - Li, Sie Yu

AU - Hsu, Chih Chao

AU - Liang, Steven Y.

PY - 2007

Y1 - 2007

N2 - Due to its smallness in size and economic-saving in batch fabrication, the acoustic micro sensor shows many potential applications in the field of manufacturing and machining monitoring system if it can help to pick up information of sound and vibration signals at specific range. In this paper, brief discussion for the design of the micro-sensor and its fabrication issue will be made. Fundamental frequency testing results by the piezo-electric shaker and acoustic measurement within the water tank are given. A 6-inch silicon wafer fabrication process and sensor design having resonant frequency in the range of 20k-60k Hz are presented and discussed. By selecting appropriate thickness of the structure layer on a SOI wafer, it is possible to customer-make a microsensor to sense within a given-range of interest and to apply it in a manufacturing monitoring system.

AB - Due to its smallness in size and economic-saving in batch fabrication, the acoustic micro sensor shows many potential applications in the field of manufacturing and machining monitoring system if it can help to pick up information of sound and vibration signals at specific range. In this paper, brief discussion for the design of the micro-sensor and its fabrication issue will be made. Fundamental frequency testing results by the piezo-electric shaker and acoustic measurement within the water tank are given. A 6-inch silicon wafer fabrication process and sensor design having resonant frequency in the range of 20k-60k Hz are presented and discussed. By selecting appropriate thickness of the structure layer on a SOI wafer, it is possible to customer-make a microsensor to sense within a given-range of interest and to apply it in a manufacturing monitoring system.

UR - https://www.scopus.com/pages/publications/37349124614

UR - https://www.scopus.com/pages/publications/37349124614#tab=citedBy

U2 - 10.1115/MSEC2007-31131

DO - 10.1115/MSEC2007-31131

M3 - Conference contribution

AN - SCOPUS:37349124614

SN - 0791842908

SN - 9780791842904

T3 - Proceedings of the ASME International Manufacturing Science and Engineering Conference 2007, MSEC2007

SP - 389

EP - 394

BT - American Society of Mechanical Engineers

T2 - 2007 ASME International Conference on Manufacturing Science and Engineering

Y2 - 15 January 2007 through 18 October 2007

ER -

Characteristic evaluation of silicon-based MEMS acoustic/acceleration sensor

Abstract

Publication series

Other

UN SDGs

All Science Journal Classification (ASJC) codes

Access to Document

Other files and links

Fingerprint

Cite this