Characteristics and reliability of metal-oxide-semiconductor transistors with various depths of plasma-induced Si recess structure

Jone-Fang Chen, Yen Lin Tsai, Chun Yen Chen, Hao Tang Hsu, Chia Yu Kao, Hann Ping Hwang

Research output: Contribution to journalArticle

Abstract

Device characteristics and hot-carrier-induced device degradation of n-channel MOS transistors with an off-state breakdown voltage of approximately 25V and various Si recess depths introduced by sidewall spacer overetching are investigated. Experimental data show that the depth of the Si recess has small effects on device characteristics. A device with a deeper Si recess has lower substrate current and channel electric field, whereas a greater hot-carrier-induced device degradation and a shorter hot-carrier lifetime are observed. Results of technology computer-aided design simulations suggest that these unexpected observations are related to the severity of plasma damage caused by the sidewall spacer overetching and the difference in topology.

Original languageEnglish
Article number04FD01
JournalJapanese Journal of Applied Physics
Volume57
Issue number4
DOIs
Publication statusPublished - 2018 Apr 1

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recesses
Hot carriers
metal oxide semiconductors
Transistors
transistors
Plasmas
Metals
Degradation
Carrier lifetime
spacers
MOSFET devices
Electric breakdown
Computer aided design
degradation
Electric fields
Topology
computer aided design
carrier lifetime
electrical faults
Substrates

All Science Journal Classification (ASJC) codes

  • Engineering(all)
  • Physics and Astronomy(all)

Cite this

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title = "Characteristics and reliability of metal-oxide-semiconductor transistors with various depths of plasma-induced Si recess structure",
abstract = "Device characteristics and hot-carrier-induced device degradation of n-channel MOS transistors with an off-state breakdown voltage of approximately 25V and various Si recess depths introduced by sidewall spacer overetching are investigated. Experimental data show that the depth of the Si recess has small effects on device characteristics. A device with a deeper Si recess has lower substrate current and channel electric field, whereas a greater hot-carrier-induced device degradation and a shorter hot-carrier lifetime are observed. Results of technology computer-aided design simulations suggest that these unexpected observations are related to the severity of plasma damage caused by the sidewall spacer overetching and the difference in topology.",
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Characteristics and reliability of metal-oxide-semiconductor transistors with various depths of plasma-induced Si recess structure. / Chen, Jone-Fang; Tsai, Yen Lin; Chen, Chun Yen; Hsu, Hao Tang; Kao, Chia Yu; Hwang, Hann Ping.

In: Japanese Journal of Applied Physics, Vol. 57, No. 4, 04FD01, 01.04.2018.

Research output: Contribution to journalArticle

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AU - Tsai, Yen Lin

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AU - Kao, Chia Yu

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