Characterization of cure-dependent viscoelastic behavior for molding compound and application to package warpage simulation

Tz Cheng Chiu, Je Li Kung, Yi Shao Lai

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

In this study a process-dependent viscoelastic model is developed for considering the constitutive relationship of an epoxy molding compound. The process dependence is realized by incorporating the phenomenological models for the cure kinetics, the cure-dependent volume shrinkage, and the cure-dependent viscoelastic stress relaxation modulus into the constitutive model for the molding compound. The cure-dependent viscoelastic model is incorporated into numerical finite element analysis to simulate warpage of an overmolded chip scale ball grid array (BGA) package under uniform cooling from reflow to room temperature. The simulation results are compared to Shadow Moiré experimental data for validating the modeling methodology. Additional finite element analyses are performed to investigate the influence of molding compound constitutive behavior (temperature-dependent elastic or viscoelastic) on the package warpage prediction, and to consider the package warpage evolution during the post-mold curing (PMC) process.

Original languageEnglish
Title of host publicationProceedings of the ASME InterPack Conference 2009, IPACK2009
Pages9-17
Number of pages9
DOIs
Publication statusPublished - 2010 Jun 30
Event2009 ASME InterPack Conference, IPACK2009 - San Francisco, CA, United States
Duration: 2009 Jul 192009 Jul 23

Publication series

NameProceedings of the ASME InterPack Conference 2009, IPACK2009
Volume2

Other

Other2009 ASME InterPack Conference, IPACK2009
CountryUnited States
CitySan Francisco, CA
Period09-07-1909-07-23

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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    Chiu, T. C., Kung, J. L., & Lai, Y. S. (2010). Characterization of cure-dependent viscoelastic behavior for molding compound and application to package warpage simulation. In Proceedings of the ASME InterPack Conference 2009, IPACK2009 (pp. 9-17). (Proceedings of the ASME InterPack Conference 2009, IPACK2009; Vol. 2). https://doi.org/10.1115/InterPACK2009-89040