Characterization of Terahertz Plasmonic Structures Based on Metallic Wire Woven Meshes

Dejun Liu, Borwen You, Ja Yu Lu, Toshiaki Hattori

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A THz plasmonic structure based on metallic wire woven meshes to support Fano resonance is presented in numerical calculation. The structure unit of the woven metal wire is critical to perform this resonance field due to its asymmetry, which is compared with the symmetry of metal-hole-array. Using different bent wires with various curvatures on the woven metal wire structure can modulate the spectral properties of resonance field in the frequency and bandwidth. High Q-factor resonance are thus optimized via the dimensions of the wire bending section and realized to confine a large volume of resonance field.

Original languageEnglish
Title of host publication2018 Progress In Electromagnetics Research Symposium, PIERS-Toyama 2018 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages588-591
Number of pages4
ISBN (Electronic)9784885523151
DOIs
Publication statusPublished - 2018 Dec 31
Event2018 Progress In Electromagnetics Research Symposium, PIERS-Toyama 2018 - Toyama, Japan
Duration: 2018 Aug 12018 Aug 4

Publication series

NameProgress in Electromagnetics Research Symposium
Volume2018-August
ISSN (Print)1559-9450
ISSN (Electronic)1931-7360

Other

Other2018 Progress In Electromagnetics Research Symposium, PIERS-Toyama 2018
CountryJapan
CityToyama
Period18-08-0118-08-04

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All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Liu, D., You, B., Lu, J. Y., & Hattori, T. (2018). Characterization of Terahertz Plasmonic Structures Based on Metallic Wire Woven Meshes. In 2018 Progress In Electromagnetics Research Symposium, PIERS-Toyama 2018 - Proceedings (pp. 588-591). [8597614] (Progress in Electromagnetics Research Symposium; Vol. 2018-August). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.23919/PIERS.2018.8597614