Characterizations of Cu/Sn-Zn solder/Ag interfaces on photovoltaic ribbon for silicon solar cells

Kuan Jen Chen, Fei Yi Hung, Truan Sheng Lui, Li Hui Chen, Yu Wen Chen

Research output: Contribution to journalArticle

6 Citations (Scopus)

Abstract

Sn-xZn (x = 9, 25, and 50 wt%) alloy solders are applied in photovoltaic (PV) ribbon and connected with silicon solar cells. The interfacial microstructures, series resistance, and bonding strength of Sn-xZn PV modules are investigated. Cu 5Zn8 and AgZn3 intermetallic compounds (IMCs) were found at the interfaces. The Zn content in the solder dominates the growth behavior of IMCs at the interface. The thickness of the Cu5Zn 8 and AgZn3 IMC layer increased with increasing Zn content in the solder, and thus, the series resistance of the PV module also increased. The growth of IMCs can enhance the interfacial adhesion strength, but excess Zn overconsumes the Ag electrode, reducing the bond strength of the PV module. Applying low-Zn-content Sn-xZn solder to PV ribbon avoids overconsumption of the Ag layer and, thus, decreases the series resistance and internal stress.

Original languageEnglish
Article number6979227
Pages (from-to)202-205
Number of pages4
JournalIEEE Journal of Photovoltaics
Volume5
Issue number1
DOIs
Publication statusPublished - 2015 Jan 1

Fingerprint

Silicon solar cells
solders
Soldering alloys
ribbons
Intermetallics
intermetallics
solar cells
modules
Bond strength (materials)
residual stress
Residual stresses
adhesion
microstructure
Microstructure
Electrodes
electrodes

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics

Cite this

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title = "Characterizations of Cu/Sn-Zn solder/Ag interfaces on photovoltaic ribbon for silicon solar cells",
abstract = "Sn-xZn (x = 9, 25, and 50 wt{\%}) alloy solders are applied in photovoltaic (PV) ribbon and connected with silicon solar cells. The interfacial microstructures, series resistance, and bonding strength of Sn-xZn PV modules are investigated. Cu 5Zn8 and AgZn3 intermetallic compounds (IMCs) were found at the interfaces. The Zn content in the solder dominates the growth behavior of IMCs at the interface. The thickness of the Cu5Zn 8 and AgZn3 IMC layer increased with increasing Zn content in the solder, and thus, the series resistance of the PV module also increased. The growth of IMCs can enhance the interfacial adhesion strength, but excess Zn overconsumes the Ag electrode, reducing the bond strength of the PV module. Applying low-Zn-content Sn-xZn solder to PV ribbon avoids overconsumption of the Ag layer and, thus, decreases the series resistance and internal stress.",
author = "Chen, {Kuan Jen} and Hung, {Fei Yi} and Lui, {Truan Sheng} and Chen, {Li Hui} and Chen, {Yu Wen}",
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Characterizations of Cu/Sn-Zn solder/Ag interfaces on photovoltaic ribbon for silicon solar cells. / Chen, Kuan Jen; Hung, Fei Yi; Lui, Truan Sheng; Chen, Li Hui; Chen, Yu Wen.

In: IEEE Journal of Photovoltaics, Vol. 5, No. 1, 6979227, 01.01.2015, p. 202-205.

Research output: Contribution to journalArticle

TY - JOUR

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AU - Chen, Kuan Jen

AU - Hung, Fei Yi

AU - Lui, Truan Sheng

AU - Chen, Li Hui

AU - Chen, Yu Wen

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AB - Sn-xZn (x = 9, 25, and 50 wt%) alloy solders are applied in photovoltaic (PV) ribbon and connected with silicon solar cells. The interfacial microstructures, series resistance, and bonding strength of Sn-xZn PV modules are investigated. Cu 5Zn8 and AgZn3 intermetallic compounds (IMCs) were found at the interfaces. The Zn content in the solder dominates the growth behavior of IMCs at the interface. The thickness of the Cu5Zn 8 and AgZn3 IMC layer increased with increasing Zn content in the solder, and thus, the series resistance of the PV module also increased. The growth of IMCs can enhance the interfacial adhesion strength, but excess Zn overconsumes the Ag electrode, reducing the bond strength of the PV module. Applying low-Zn-content Sn-xZn solder to PV ribbon avoids overconsumption of the Ag layer and, thus, decreases the series resistance and internal stress.

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