Characterizations of Cu/Sn-Zn solder/Ag interfaces on photovoltaic ribbon for silicon solar cells

Kuan Jen Chen, Fei Yi Hung, Truan Sheng Lui, Li Hui Chen, Yu Wen Chen

Research output: Contribution to journalArticlepeer-review

7 Citations (Scopus)

Abstract

Sn-xZn (x = 9, 25, and 50 wt%) alloy solders are applied in photovoltaic (PV) ribbon and connected with silicon solar cells. The interfacial microstructures, series resistance, and bonding strength of Sn-xZn PV modules are investigated. Cu 5Zn8 and AgZn3 intermetallic compounds (IMCs) were found at the interfaces. The Zn content in the solder dominates the growth behavior of IMCs at the interface. The thickness of the Cu5Zn 8 and AgZn3 IMC layer increased with increasing Zn content in the solder, and thus, the series resistance of the PV module also increased. The growth of IMCs can enhance the interfacial adhesion strength, but excess Zn overconsumes the Ag electrode, reducing the bond strength of the PV module. Applying low-Zn-content Sn-xZn solder to PV ribbon avoids overconsumption of the Ag layer and, thus, decreases the series resistance and internal stress.

Original languageEnglish
Article number6979227
Pages (from-to)202-205
Number of pages4
JournalIEEE Journal of Photovoltaics
Volume5
Issue number1
DOIs
Publication statusPublished - 2015 Jan 1

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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