Co-synthesis of floorplanning and powerplanning in 3D ICs for multiple supply voltage designs

Jai Ming Lin, Chien Yu Huang, Jhih Ying Yang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

This paper addresses a 3D floorplanning methodology, which considers floorplanning and powerplanning at the same time for Multiple Supply Voltage (MSV) circuits. Physical design becomes more complex for MSV designs since modules with the same power domain have to be placed at close locations in 3D space to facilitate powerplanning and reduce IR-drop, which would deteriorate wirelength. By properly partitioning modules of the same power domain into several voltage islands and increasing overlap area of the voltage islands in contiguous dies, we can reduce routing resource usage without increasing wirelength significantly. Further, unlike previous works, our approach not only can handle a netlist with soft modules and hard modules but also can meet the fixed-outline constraint. The experimental results show that our methodology gets better results than other approach in designs with single voltage domain and is also promising for MSV designs.

Original languageEnglish
Title of host publicationProceedings of the 2018 Design, Automation and Test in Europe Conference and Exhibition, DATE 2018
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1339-1344
Number of pages6
ISBN (Electronic)9783981926316
DOIs
Publication statusPublished - 2018 Apr 19
Event2018 Design, Automation and Test in Europe Conference and Exhibition, DATE 2018 - Dresden, Germany
Duration: 2018 Mar 192018 Mar 23

Publication series

NameProceedings of the 2018 Design, Automation and Test in Europe Conference and Exhibition, DATE 2018
Volume2018-January

Other

Other2018 Design, Automation and Test in Europe Conference and Exhibition, DATE 2018
CountryGermany
CityDresden
Period18-03-1918-03-23

All Science Journal Classification (ASJC) codes

  • Safety, Risk, Reliability and Quality
  • Hardware and Architecture
  • Software
  • Information Systems and Management

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