Communication Standards

Fan Tien Cheng, Hao Tieng, Yu Chen Chiu

Research output: Chapter in Book/Report/Conference proceedingChapter


Communication standards support the entire data-exchange requirements of Intelligent Manufacturing. Since e-Manufacturing of the semiconductor industry is the predecessor of Industry 4.0, the communication standards are organized into two categories: semiconductor equipment as well as industrial devices and systems. The communication standards for the semiconductor industry were emphasized prior to other industries due to its industrial characteristics. This chapter describes the historical roadmaps of classic Open Platform Communication (OPC) and OPC Unified Architecture (UA), and introduces the specifications and target applications of OPC-UA. It presents an Intelligent Manufacturing hierarchy example of Flexible Copper Clad Laminate industry applying OPC-UA protocols. OPC DA was designed as an interface to communication drivers, allowing a standardized read and write access to current data in automation devices. Classic OPC is used today as a standardized interface between automation systems in different levels of the automation pyramid.

Original languageEnglish
Title of host publicationIndustry 4.1
Subtitle of host publicationIntelligent Manufacturing with Zero Defects
Number of pages60
ISBN (Electronic)9781119739920
ISBN (Print)9781119739890
Publication statusPublished - 2021 Jan 1

All Science Journal Classification (ASJC) codes

  • General Engineering


Dive into the research topics of 'Communication Standards'. Together they form a unique fingerprint.

Cite this