Abstract
Communication standards support the entire data-exchange requirements of Intelligent Manufacturing. Since e-Manufacturing of the semiconductor industry is the predecessor of Industry 4.0, the communication standards are organized into two categories: semiconductor equipment as well as industrial devices and systems. The communication standards for the semiconductor industry were emphasized prior to other industries due to its industrial characteristics. This chapter describes the historical roadmaps of classic Open Platform Communication (OPC) and OPC Unified Architecture (UA), and introduces the specifications and target applications of OPC-UA. It presents an Intelligent Manufacturing hierarchy example of Flexible Copper Clad Laminate industry applying OPC-UA protocols. OPC DA was designed as an interface to communication drivers, allowing a standardized read and write access to current data in automation devices. Classic OPC is used today as a standardized interface between automation systems in different levels of the automation pyramid.
| Original language | English |
|---|---|
| Title of host publication | Industry 4.1 |
| Subtitle of host publication | Intelligent Manufacturing with Zero Defects |
| Publisher | wiley |
| Pages | 69-128 |
| Number of pages | 60 |
| ISBN (Electronic) | 9781119739920 |
| ISBN (Print) | 9781119739890 |
| DOIs | |
| Publication status | Published - 2021 Jan 1 |
All Science Journal Classification (ASJC) codes
- General Engineering