Comparison of free abrasive machining processes in wafer manufacturing

Chunhui Chung, Imin Kao

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

Free abrasive machining (FAM) processes, such as slicing using slurry wiresaws, lapping, and polishing, are very important manufacturing processes in wafer production for microelectronics fabrication. Since the materials in semiconductor industry are usually brittle, such as silicon, gallium arsenide,... etc., the FAM processed can provide more gentle machining than the bonded abrasive machining process. Various machining theories and models have been developed to understand those processes. In this paper, the free abrasive machining processes in wafer manufacturing will be discussed in conjunction with the brittle material cracking theory. The modern slurry wire-saw slicing process and lapping process in wafer production will be presented with comparison to abrasive grits, manufacturing process models, characterization of manufacturing mechanisms, and properties of processes.

Original languageEnglish
Title of host publicationProceedings of the ASME International Manufacturing Science and Engineering Conference, MSEC2008
Pages681-688
Number of pages8
DOIs
Publication statusPublished - 2009
EventASME International Manufacturing Science and Engineering Conference, MSEC2008 - Evanston, IL, United States
Duration: 2008 Oct 72008 Oct 10

Publication series

NameProceedings of the ASME International Manufacturing Science and Engineering Conference, MSEC2008
Volume1

Other

OtherASME International Manufacturing Science and Engineering Conference, MSEC2008
Country/TerritoryUnited States
CityEvanston, IL
Period08-10-0708-10-10

All Science Journal Classification (ASJC) codes

  • Industrial and Manufacturing Engineering
  • Mechanical Engineering

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