Competitive adsorption between bis(3-sodiumsulfopropyl disulfide) and polyalkylene glycols on copper electroplating

Chi Cheng Hung, Ying Lang Wang, Wen-Shi Lee, Shih Chieh Chang

Research output: Contribution to journalArticle

9 Citations (Scopus)

Abstract

In semiconductor copper (Cu) metallization, external organic additives including bis(3-sodiumsulfopropyl disulfide) (SPS) and polyalkylene glycols (PAG) are necessary and widely used to improve the gap-fill capability of Cu electroplating for high-aspect-ratio features. In this study, the interaction of SPS and PAG (SPS-PAG) in the electrolytes was investigated. The results not only show the antisuppression effects of SPS in the presence of PAG, but also indicate the competitive adsorption between SPS and PAG. The proposed mechanism is that when SPS-PAG are added to a plating bath, the Cu-electroplating rate is influenced by competing adsorptions of SPS-PAG and SPS, which disperses PAG species far away from the Cu surface to enhance electroplating rates. The elements (charge-transfer resistance, adsorption-layer resistance, and inductance) of the equivalent circuit simulated using the electrochemistry- impedance spectroscopy data also demonstrate the behavior of SPS-PAG competing reactions.

Original languageEnglish
JournalJournal of the Electrochemical Society
Volume155
Issue number9
DOIs
Publication statusPublished - 2008 Aug 15

Fingerprint

Glycols
Electroplating
Disulfides
Copper
Adsorption
Electrochemistry
Metallizing
Plating
Equivalent circuits
Inductance
Electrolytes
Charge transfer
Aspect ratio
Spectroscopy
Semiconductor materials

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Renewable Energy, Sustainability and the Environment
  • Surfaces, Coatings and Films
  • Electrochemistry
  • Materials Chemistry

Cite this

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title = "Competitive adsorption between bis(3-sodiumsulfopropyl disulfide) and polyalkylene glycols on copper electroplating",
abstract = "In semiconductor copper (Cu) metallization, external organic additives including bis(3-sodiumsulfopropyl disulfide) (SPS) and polyalkylene glycols (PAG) are necessary and widely used to improve the gap-fill capability of Cu electroplating for high-aspect-ratio features. In this study, the interaction of SPS and PAG (SPS-PAG) in the electrolytes was investigated. The results not only show the antisuppression effects of SPS in the presence of PAG, but also indicate the competitive adsorption between SPS and PAG. The proposed mechanism is that when SPS-PAG are added to a plating bath, the Cu-electroplating rate is influenced by competing adsorptions of SPS-PAG and SPS, which disperses PAG species far away from the Cu surface to enhance electroplating rates. The elements (charge-transfer resistance, adsorption-layer resistance, and inductance) of the equivalent circuit simulated using the electrochemistry- impedance spectroscopy data also demonstrate the behavior of SPS-PAG competing reactions.",
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Competitive adsorption between bis(3-sodiumsulfopropyl disulfide) and polyalkylene glycols on copper electroplating. / Hung, Chi Cheng; Wang, Ying Lang; Lee, Wen-Shi; Chang, Shih Chieh.

In: Journal of the Electrochemical Society, Vol. 155, No. 9, 15.08.2008.

Research output: Contribution to journalArticle

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T1 - Competitive adsorption between bis(3-sodiumsulfopropyl disulfide) and polyalkylene glycols on copper electroplating

AU - Hung, Chi Cheng

AU - Wang, Ying Lang

AU - Lee, Wen-Shi

AU - Chang, Shih Chieh

PY - 2008/8/15

Y1 - 2008/8/15

N2 - In semiconductor copper (Cu) metallization, external organic additives including bis(3-sodiumsulfopropyl disulfide) (SPS) and polyalkylene glycols (PAG) are necessary and widely used to improve the gap-fill capability of Cu electroplating for high-aspect-ratio features. In this study, the interaction of SPS and PAG (SPS-PAG) in the electrolytes was investigated. The results not only show the antisuppression effects of SPS in the presence of PAG, but also indicate the competitive adsorption between SPS and PAG. The proposed mechanism is that when SPS-PAG are added to a plating bath, the Cu-electroplating rate is influenced by competing adsorptions of SPS-PAG and SPS, which disperses PAG species far away from the Cu surface to enhance electroplating rates. The elements (charge-transfer resistance, adsorption-layer resistance, and inductance) of the equivalent circuit simulated using the electrochemistry- impedance spectroscopy data also demonstrate the behavior of SPS-PAG competing reactions.

AB - In semiconductor copper (Cu) metallization, external organic additives including bis(3-sodiumsulfopropyl disulfide) (SPS) and polyalkylene glycols (PAG) are necessary and widely used to improve the gap-fill capability of Cu electroplating for high-aspect-ratio features. In this study, the interaction of SPS and PAG (SPS-PAG) in the electrolytes was investigated. The results not only show the antisuppression effects of SPS in the presence of PAG, but also indicate the competitive adsorption between SPS and PAG. The proposed mechanism is that when SPS-PAG are added to a plating bath, the Cu-electroplating rate is influenced by competing adsorptions of SPS-PAG and SPS, which disperses PAG species far away from the Cu surface to enhance electroplating rates. The elements (charge-transfer resistance, adsorption-layer resistance, and inductance) of the equivalent circuit simulated using the electrochemistry- impedance spectroscopy data also demonstrate the behavior of SPS-PAG competing reactions.

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