Computer-Aided design of a TSOP II LOC package using Taguchi's parameter design method to optimize mold-flow balance

Hung Lung Lee, Shyang Jye Chang, Sheng Jye Hwang, Francis Su, S. K. Chen

Research output: Contribution to journalArticle

16 Citations (Scopus)

Abstract

This paper presents a methodology for TSOP II LOC packaging design. The design objectives are: 1) to optimize mold-flow balance, which in turn minimizes air traps, and 2) to minimize manufacturing variability which implies optimal quality. A mold-flow simulation tool called C-MOLD is used to evaluate various design configurations. Taguchi's robust design method is used for manufacturing variability considerations. The simulated results are verified with experimental flow patterns produced by means of "short shots." In the nomenclature of the Taguchi method, mold-flow balance was chosen as quality characteristics and select a set of design parameters called control factors. The objectives are to find the levels of the control factors, which optimize the flow balance, and, at the same time, minimize the sensitivity of the variations of the control factors.

Original languageEnglish
Pages (from-to)268-275
Number of pages8
JournalJournal of Electronic Packaging, Transactions of the ASME
Volume125
Issue number2 SPEC.
DOIs
Publication statusPublished - 2003 Jun 1

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials
  • Computer Science Applications
  • Electrical and Electronic Engineering

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