TY - GEN
T1 - Configuring AVM as a MES componConfiguring AVM as a MES component
AU - Cheng, Fan Tien
AU - Chang, Jonathan Yung Cheng
AU - Kao, Chi An
AU - Chen, Ying Lin
AU - Peng, Ju Lei
PY - 2010
Y1 - 2010
N2 - A typical 65nm manufacturing process normally contains 400-500 process steps. Many factors in production line could cause production quality shift and/or drift. Especially, when a new process to include more functions in a die is under development, a higher failure rate will be encountered. As a result, frequent monitoring in both tool and process is required to detect the quality issue early so as to improve the process stability of semiconductor manufacturing. However, more tool and process monitoring means more metrology operation cost and longer cycle time. Recently, a promising technology denoted virtual metrology (VM) is blooming. VM can convert sampling inspection with metrology delay into real-time and on-line total inspection. Therefore, VM has now been designated by International SEMATECH Manufacturing Initiative (ISMI) and International Technology Roadmap for Semiconductors (ITRS) as one of the focus areas for the next generation factory realization roadmap of the semiconductor industry. The authors have developed the so-called automatic virtual metrology (AVM) system to implement and deploy the VM operations automatically. This paper proposes a novel manufacturing system that integrates AVM into the manufacturing execution system (MES). The interfaces among AVM, other MES components, and R2R (run-to-run) modules in the novel manufacturing system are also defined such that the capabilities of AVM can be accomplished. The AVM capabilities include 1) converting sampling inspection with metrology delay into real-time and on-line total inspection; 2) control/monitoring workpieces reduction/elimination; and 3) supporting wafer-to-wafer (W2W) advanced process control.
AB - A typical 65nm manufacturing process normally contains 400-500 process steps. Many factors in production line could cause production quality shift and/or drift. Especially, when a new process to include more functions in a die is under development, a higher failure rate will be encountered. As a result, frequent monitoring in both tool and process is required to detect the quality issue early so as to improve the process stability of semiconductor manufacturing. However, more tool and process monitoring means more metrology operation cost and longer cycle time. Recently, a promising technology denoted virtual metrology (VM) is blooming. VM can convert sampling inspection with metrology delay into real-time and on-line total inspection. Therefore, VM has now been designated by International SEMATECH Manufacturing Initiative (ISMI) and International Technology Roadmap for Semiconductors (ITRS) as one of the focus areas for the next generation factory realization roadmap of the semiconductor industry. The authors have developed the so-called automatic virtual metrology (AVM) system to implement and deploy the VM operations automatically. This paper proposes a novel manufacturing system that integrates AVM into the manufacturing execution system (MES). The interfaces among AVM, other MES components, and R2R (run-to-run) modules in the novel manufacturing system are also defined such that the capabilities of AVM can be accomplished. The AVM capabilities include 1) converting sampling inspection with metrology delay into real-time and on-line total inspection; 2) control/monitoring workpieces reduction/elimination; and 3) supporting wafer-to-wafer (W2W) advanced process control.
UR - http://www.scopus.com/inward/record.url?scp=77957569490&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=77957569490&partnerID=8YFLogxK
U2 - 10.1109/ASMC.2010.5551454
DO - 10.1109/ASMC.2010.5551454
M3 - Conference contribution
AN - SCOPUS:77957569490
SN - 9781424465170
T3 - ASMC (Advanced Semiconductor Manufacturing Conference) Proceedings
SP - 226
EP - 231
BT - 2010 IEEE/SEMI Advanced Semiconductor Manufacturing Conference, ASMC 2010
T2 - 2010 IEEE/SEMI Advanced Semiconductor Manufacturing Conference, ASMC 2010
Y2 - 11 July 2010 through 13 July 2010
ER -