Contact printing of metallic pattern and its applications on fabricating high-frequency surface acoustic wave (SAW) devices

Yung Chun Lee, Chun Hung Chen, Hsueh Liang Chen, Chin Hsin Liu, Cheng Yu Chiu, Hung Yi Lin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this paper, two types of contact-printing methods for micro/nano-lithography are developed and their application on fabricating high-frequency surface acoustic wave (SAW) devices are investigated. First of all, a Light-Assisted Metal Film Patterning (LAMP) method which transfers a patterned metal film directly from a silicon mold to a substrate is discussed. The pattern transformation relies on both mechanical contact pressure and optical heating at the interface. Metal patterns with 100 nm feature size can be easily transferred in laboratory using simple equipments. Secondly, a Contact-Transfer and Mask-Embedded Lithography (CMEL) is proposed which cleverly arranges pure mechanical forces and surface energy difference to achieve the patterning of nano-structures on various kinds of substrates. Applications of these two developed methods are demonstrated on the fabrication of high-frequency (∼2 GHz) surface acoustic wave (SAW) filters and resonators. Future developments and potential applications of these nanoimprinting and nano-patterning methods will be addressed.

Original languageEnglish
Title of host publicationICSICT 2008 - 2008 9th International Conference on Solid-State and Integrated-Circuit Technology Proceedings
Pages2456-2459
Number of pages4
DOIs
Publication statusPublished - 2008 Dec 1
Event2008 9th International Conference on Solid-State and Integrated-Circuit Technology, ICSICT 2008 - Beijing, China
Duration: 2008 Oct 202008 Oct 23

Publication series

NameInternational Conference on Solid-State and Integrated Circuits Technology Proceedings, ICSICT

Other

Other2008 9th International Conference on Solid-State and Integrated-Circuit Technology, ICSICT 2008
CountryChina
CityBeijing
Period08-10-2008-10-23

Fingerprint

Acoustic surface wave devices
surface acoustic wave devices
printing
Printing
metal films
Lithography
Light Metals
lithography
Metals
Acoustic surface wave filters
Silicon
Substrates
Interfacial energy
surface energy
Masks
Resonators
masks
resonators
filters
Heating

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Condensed Matter Physics
  • Electronic, Optical and Magnetic Materials

Cite this

Lee, Y. C., Chen, C. H., Chen, H. L., Liu, C. H., Chiu, C. Y., & Lin, H. Y. (2008). Contact printing of metallic pattern and its applications on fabricating high-frequency surface acoustic wave (SAW) devices. In ICSICT 2008 - 2008 9th International Conference on Solid-State and Integrated-Circuit Technology Proceedings (pp. 2456-2459). [4735086] (International Conference on Solid-State and Integrated Circuits Technology Proceedings, ICSICT). https://doi.org/10.1109/ICSICT.2008.4735086
Lee, Yung Chun ; Chen, Chun Hung ; Chen, Hsueh Liang ; Liu, Chin Hsin ; Chiu, Cheng Yu ; Lin, Hung Yi. / Contact printing of metallic pattern and its applications on fabricating high-frequency surface acoustic wave (SAW) devices. ICSICT 2008 - 2008 9th International Conference on Solid-State and Integrated-Circuit Technology Proceedings. 2008. pp. 2456-2459 (International Conference on Solid-State and Integrated Circuits Technology Proceedings, ICSICT).
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Lee, YC, Chen, CH, Chen, HL, Liu, CH, Chiu, CY & Lin, HY 2008, Contact printing of metallic pattern and its applications on fabricating high-frequency surface acoustic wave (SAW) devices. in ICSICT 2008 - 2008 9th International Conference on Solid-State and Integrated-Circuit Technology Proceedings., 4735086, International Conference on Solid-State and Integrated Circuits Technology Proceedings, ICSICT, pp. 2456-2459, 2008 9th International Conference on Solid-State and Integrated-Circuit Technology, ICSICT 2008, Beijing, China, 08-10-20. https://doi.org/10.1109/ICSICT.2008.4735086

Contact printing of metallic pattern and its applications on fabricating high-frequency surface acoustic wave (SAW) devices. / Lee, Yung Chun; Chen, Chun Hung; Chen, Hsueh Liang; Liu, Chin Hsin; Chiu, Cheng Yu; Lin, Hung Yi.

ICSICT 2008 - 2008 9th International Conference on Solid-State and Integrated-Circuit Technology Proceedings. 2008. p. 2456-2459 4735086 (International Conference on Solid-State and Integrated Circuits Technology Proceedings, ICSICT).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Lee YC, Chen CH, Chen HL, Liu CH, Chiu CY, Lin HY. Contact printing of metallic pattern and its applications on fabricating high-frequency surface acoustic wave (SAW) devices. In ICSICT 2008 - 2008 9th International Conference on Solid-State and Integrated-Circuit Technology Proceedings. 2008. p. 2456-2459. 4735086. (International Conference on Solid-State and Integrated Circuits Technology Proceedings, ICSICT). https://doi.org/10.1109/ICSICT.2008.4735086