Contributions of ion-induced damage restoration and removal in GaN light emitting diodes

Yen Tang Lyu, Yu Ren Liu, Day Shan Liu, Ching Ting Lee

Research output: Contribution to journalArticlepeer-review

1 Citation (Scopus)

Abstract

The reactive-ion etching method has been widely used for fabricating GaN based devices. However, ion-induced damage degrades the performance of the resultant devices. In this paper, using KOH and H3PO4:H2O chemical solution treatments, the ohmic resistance of GaN LEDs can be improved by the removal of native oxide. However, the reverse current-voltage characteristics of the GaN LEDs are degraded because of the enlargement and the depth of the resulting hexagonal etched pits. Using thermal annealing above 700 °C, the reverse breakdown performance of the GaN LEDs can be improved by restoration of the ion-induced damage. However, at a temperature higher than 1000 °C, both the forward and reverse current-voltage characteristics of the GaN LEDs are degraded because of the decomposition of GaN and the loss of nitrogen.

Original languageEnglish
Pages (from-to)173-180
Number of pages8
JournalJournal of the Chinese Institute of Electrical Engineering, Transactions of the Chinese Institute of Engineers, Series E/Chung KuoTien Chi Kung Chieng Hsueh K'an
Volume7
Issue number3
Publication statusPublished - 2000 Aug 1

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

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