Converting the infrared thermal image into temperature field for detection the defects inside materials

Terry Y. Chen, Ming Hsuan Kuo

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

Infrared thermography inspection is a full-field, non-contact method that allows the defects inside the materials to be detected at one time. However, an interface is required to transfer the gray-level represented infrared image into temperature field for further evaluation. Based on the theory of radiation and the principle of infrared camera's signal conversion, a method to convert the gray level represented infrared thermal image into temperature field is developed. Test of the method on a cup of hot water was done. The temperature obtained by the proposed method and a commercial ones agree very well with each other. An average error less than 0.9% was achieved between them.

Original languageEnglish
Title of host publicationEighth International Symposium on Precision Engineering Measurements and Instrumentation
DOIs
Publication statusPublished - 2013 Apr 12
Event8th International Symposium on Precision Engineering Measurements and Instrumentation - Chengdu, China
Duration: 2012 Aug 82012 Aug 11

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume8759
ISSN (Print)0277-786X

Other

Other8th International Symposium on Precision Engineering Measurements and Instrumentation
CountryChina
CityChengdu
Period12-08-0812-08-11

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'Converting the infrared thermal image into temperature field for detection the defects inside materials'. Together they form a unique fingerprint.

  • Cite this

    Chen, T. Y., & Kuo, M. H. (2013). Converting the infrared thermal image into temperature field for detection the defects inside materials. In Eighth International Symposium on Precision Engineering Measurements and Instrumentation [87594L] (Proceedings of SPIE - The International Society for Optical Engineering; Vol. 8759). https://doi.org/10.1117/12.2015771