Cooling enhancement of electronic packages by modified barriers

J. H. Chou, M. C. Chen, J. Lee, Z. I. Fuu

Research output: Contribution to conferencePaper

Abstract

An experimental investigation has been conducted to study the merit and the physical mechanism involved in using barriers as local heat transfer promoters for an array of ninety simulated LSI packages. Both heat transfer coefficients and pressure drop coefficients were measured by an infrared thermal imaging radiometer and surface pressure tabs, respectively. The results indicate that thick modified barriers with a proper opening ratio will increase the local heat transfer coefficient and decrease the overall pressure loss coefficient. This is due to the formation of large scale horseshoe vortex and the fact that flow has more passage. Also thin modified barriers will have even larger local heat transfer coefficient due to its larger vortex structure.

Original languageEnglish
Pages673-678
Number of pages6
Publication statusPublished - 1993 Dec 1
EventProceedings of the ASME International Electronics Packaging Conference. Part 2 (of 2) - Binghamton, NY, USA
Duration: 1993 Sep 291993 Oct 2

Other

OtherProceedings of the ASME International Electronics Packaging Conference. Part 2 (of 2)
CityBinghamton, NY, USA
Period93-09-2993-10-02

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Mechanical Engineering

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    Chou, J. H., Chen, M. C., Lee, J., & Fuu, Z. I. (1993). Cooling enhancement of electronic packages by modified barriers. 673-678. Paper presented at Proceedings of the ASME International Electronics Packaging Conference. Part 2 (of 2), Binghamton, NY, USA, .