Cooling enhancement of electronic packages by modified barriers

J. H. Chou; M. C. Chen; J. Lee; Z. I. Fuu

Cooling enhancement of electronic packages by modified barriers

J. H. Chou, M. C. Chen, J. Lee, Z. I. Fuu

Department of Engineering Science

Research output: Contribution to conference › Paper › peer-review

Abstract

An experimental investigation has been conducted to study the merit and the physical mechanism involved in using barriers as local heat transfer promoters for an array of ninety simulated LSI packages. Both heat transfer coefficients and pressure drop coefficients were measured by an infrared thermal imaging radiometer and surface pressure tabs, respectively. The results indicate that thick modified barriers with a proper opening ratio will increase the local heat transfer coefficient and decrease the overall pressure loss coefficient. This is due to the formation of large scale horseshoe vortex and the fact that flow has more passage. Also thin modified barriers will have even larger local heat transfer coefficient due to its larger vortex structure.

Original language	English
Pages	673-678
Number of pages	6
Publication status	Published - 1993
Event	Proceedings of the ASME International Electronics Packaging Conference. Part 2 (of 2) - Binghamton, NY, USA Duration: 1993 Sep 29 → 1993 Oct 2

Other

Other	Proceedings of the ASME International Electronics Packaging Conference. Part 2 (of 2)
City	Binghamton, NY, USA
Period	93-09-29 → 93-10-02

All Science Journal Classification (ASJC) codes

Electrical and Electronic Engineering
Mechanical Engineering

Cite this

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title = "Cooling enhancement of electronic packages by modified barriers",

abstract = "An experimental investigation has been conducted to study the merit and the physical mechanism involved in using barriers as local heat transfer promoters for an array of ninety simulated LSI packages. Both heat transfer coefficients and pressure drop coefficients were measured by an infrared thermal imaging radiometer and surface pressure tabs, respectively. The results indicate that thick modified barriers with a proper opening ratio will increase the local heat transfer coefficient and decrease the overall pressure loss coefficient. This is due to the formation of large scale horseshoe vortex and the fact that flow has more passage. Also thin modified barriers will have even larger local heat transfer coefficient due to its larger vortex structure.",

author = "Chou, {J. H.} and Chen, {M. C.} and J. Lee and Fuu, {Z. I.}",

year = "1993",

language = "English",

pages = "673--678",

note = "Proceedings of the ASME International Electronics Packaging Conference. Part 2 (of 2) ; Conference date: 29-09-1993 Through 02-10-1993",

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TY - CONF

T1 - Cooling enhancement of electronic packages by modified barriers

AU - Chou, J. H.

AU - Chen, M. C.

AU - Lee, J.

AU - Fuu, Z. I.

PY - 1993

Y1 - 1993

N2 - An experimental investigation has been conducted to study the merit and the physical mechanism involved in using barriers as local heat transfer promoters for an array of ninety simulated LSI packages. Both heat transfer coefficients and pressure drop coefficients were measured by an infrared thermal imaging radiometer and surface pressure tabs, respectively. The results indicate that thick modified barriers with a proper opening ratio will increase the local heat transfer coefficient and decrease the overall pressure loss coefficient. This is due to the formation of large scale horseshoe vortex and the fact that flow has more passage. Also thin modified barriers will have even larger local heat transfer coefficient due to its larger vortex structure.

AB - An experimental investigation has been conducted to study the merit and the physical mechanism involved in using barriers as local heat transfer promoters for an array of ninety simulated LSI packages. Both heat transfer coefficients and pressure drop coefficients were measured by an infrared thermal imaging radiometer and surface pressure tabs, respectively. The results indicate that thick modified barriers with a proper opening ratio will increase the local heat transfer coefficient and decrease the overall pressure loss coefficient. This is due to the formation of large scale horseshoe vortex and the fact that flow has more passage. Also thin modified barriers will have even larger local heat transfer coefficient due to its larger vortex structure.

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M3 - Paper

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T2 - Proceedings of the ASME International Electronics Packaging Conference. Part 2 (of 2)

Y2 - 29 September 1993 through 2 October 1993

ER -

Cooling enhancement of electronic packages by modified barriers

Abstract

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All Science Journal Classification (ASJC) codes

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