Abstract
An experimental investigation has been conducted to study the merit and the physical mechanism involved in using barriers as local heat transfer promoters for an array of ninety simulated LSI packages. Both heat transfer coefficients and pressure drop coefficients were measured by an infrared thermal imaging radiometer and surface pressure tabs, respectively. The results indicate that thick modified barriers with a proper opening ratio will increase the local heat transfer coefficient and decrease the overall pressure loss coefficient. This is due to the formation of large scale horseshoe vortex and the fact that flow has more passage. Also thin modified barriers will have even larger local heat transfer coefficient due to its larger vortex structure.
Original language | English |
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Pages | 673-678 |
Number of pages | 6 |
Publication status | Published - 1993 |
Event | Proceedings of the ASME International Electronics Packaging Conference. Part 2 (of 2) - Binghamton, NY, USA Duration: 1993 Sept 29 → 1993 Oct 2 |
Other
Other | Proceedings of the ASME International Electronics Packaging Conference. Part 2 (of 2) |
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City | Binghamton, NY, USA |
Period | 93-09-29 → 93-10-02 |
All Science Journal Classification (ASJC) codes
- Electrical and Electronic Engineering
- Mechanical Engineering