Corrosion behavior of Pb-free Sn-1Ag-0.5Cu-XNi solder alloys in 3.5% NaCl solution

Udit Surya Mohanty, Kwang-Lung Lin

Research output: Contribution to journalArticle

11 Citations (Scopus)

Abstract

Potentiodynamic polarization techniques were employed in the present study to investigate the corrosion behavior of Pb-free Sn-1Ag-0.5Cu-XNi solder alloys in 3.5% NaCl solution. Polarization studies indicated that an increase in Ni content from 0.05 wt.% to 1 wt.% in the solder alloy shifted the corrosion potential (E corr) towards more negative values and increased the linear polarization resistance. Increased addition of Ni to 1 wt.% resulted in significant increase in the concentration of both Sn and Ni oxides on the outer surface. Secondary-ion mass spectrometry and Auger depth profile analysis revealed that oxides of tin contributed primarily towards the formation of the passive film on the surface of the solder alloys containing 0.05 wt.% and 1 wt.% Ni. Scanning electron microscopy (SEM) and energy-dispersive x-ray spectroscopy (EDX) established the formation of a Sn whisker near the passive region of the solder alloy obtained from the polarization curves. The formation of Sn whiskers was due to the buildup of compressive stress generated by the increase in the volume of the oxides of Sn and Ni formed on the outer surface. The presence of Cl- was responsible for the breakdown of the passive film, and significant pitting corrosion in the form of distinct pits was noticed in Sn-1Ag-0.5Cu-0.5Ni solder alloy after the polarization experiment.

Original languageEnglish
Pages (from-to)628-638
Number of pages11
JournalJournal of Electronic Materials
Volume42
Issue number4
DOIs
Publication statusPublished - 2013 Apr 1

Fingerprint

solders
Soldering alloys
corrosion
Corrosion
Polarization
polarization
Oxides
oxides
pitting
Potentiodynamic polarization
Secondary ion mass spectrometry
Pitting
linear polarization
Compressive stress
x ray spectroscopy
secondary ion mass spectrometry
Tin
tin
breakdown
Spectroscopy

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

Cite this

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title = "Corrosion behavior of Pb-free Sn-1Ag-0.5Cu-XNi solder alloys in 3.5{\%} NaCl solution",
abstract = "Potentiodynamic polarization techniques were employed in the present study to investigate the corrosion behavior of Pb-free Sn-1Ag-0.5Cu-XNi solder alloys in 3.5{\%} NaCl solution. Polarization studies indicated that an increase in Ni content from 0.05 wt.{\%} to 1 wt.{\%} in the solder alloy shifted the corrosion potential (E corr) towards more negative values and increased the linear polarization resistance. Increased addition of Ni to 1 wt.{\%} resulted in significant increase in the concentration of both Sn and Ni oxides on the outer surface. Secondary-ion mass spectrometry and Auger depth profile analysis revealed that oxides of tin contributed primarily towards the formation of the passive film on the surface of the solder alloys containing 0.05 wt.{\%} and 1 wt.{\%} Ni. Scanning electron microscopy (SEM) and energy-dispersive x-ray spectroscopy (EDX) established the formation of a Sn whisker near the passive region of the solder alloy obtained from the polarization curves. The formation of Sn whiskers was due to the buildup of compressive stress generated by the increase in the volume of the oxides of Sn and Ni formed on the outer surface. The presence of Cl- was responsible for the breakdown of the passive film, and significant pitting corrosion in the form of distinct pits was noticed in Sn-1Ag-0.5Cu-0.5Ni solder alloy after the polarization experiment.",
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Corrosion behavior of Pb-free Sn-1Ag-0.5Cu-XNi solder alloys in 3.5% NaCl solution. / Mohanty, Udit Surya; Lin, Kwang-Lung.

In: Journal of Electronic Materials, Vol. 42, No. 4, 01.04.2013, p. 628-638.

Research output: Contribution to journalArticle

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AB - Potentiodynamic polarization techniques were employed in the present study to investigate the corrosion behavior of Pb-free Sn-1Ag-0.5Cu-XNi solder alloys in 3.5% NaCl solution. Polarization studies indicated that an increase in Ni content from 0.05 wt.% to 1 wt.% in the solder alloy shifted the corrosion potential (E corr) towards more negative values and increased the linear polarization resistance. Increased addition of Ni to 1 wt.% resulted in significant increase in the concentration of both Sn and Ni oxides on the outer surface. Secondary-ion mass spectrometry and Auger depth profile analysis revealed that oxides of tin contributed primarily towards the formation of the passive film on the surface of the solder alloys containing 0.05 wt.% and 1 wt.% Ni. Scanning electron microscopy (SEM) and energy-dispersive x-ray spectroscopy (EDX) established the formation of a Sn whisker near the passive region of the solder alloy obtained from the polarization curves. The formation of Sn whiskers was due to the buildup of compressive stress generated by the increase in the volume of the oxides of Sn and Ni formed on the outer surface. The presence of Cl- was responsible for the breakdown of the passive film, and significant pitting corrosion in the form of distinct pits was noticed in Sn-1Ag-0.5Cu-0.5Ni solder alloy after the polarization experiment.

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