Copper is one of the most demanded commercial metal/alloys in world market. The demand for copper in industries such as electrical, electronics, automobile, telecommunications, defence, etc. as well as in daily life has escalated in the recent years due to its versatile physical and chemical properties. However destruction of copper surface by any means, preferably corrosion, can limit its vast application. For protection from corrosion, various techniques are used to coat metal substrates with passivating materials. These techniques are either complex as well as expensive, or provide incomplete protection in acid media. To address these issues, floating film transfer method (FFTM) is utilized in this work for obtaining ultrathin film of squaraine (passivating molecule) as well as their easy and fast transfer over copper substrate. The squaraine film is deposited on copper substrate in layers, viz., 1 to 4 layers. The corrosion behavior is examined in 0.1 M HCl using electrochemical techniques as well as surface characterization techniques, which portray that copper corrosion is hampered in harmony with the layers deposited. Nearly 40% corrosion protection is reached for copper coated with 1 layer of squaraine. However, the protection is amplified up to 98% with 4 layers of squaraine, which clearly substantiates the supremacy of this coating method over reported methods of protection. This technique and the material (squaraine) are both for the first time being used in the field of corrosion protection. The easy growth of ultrathin film at air-water interface as well as its rapid transfer over substrate promotes use of FFTM for efficient corrosion protection on industrial scale.
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