Coupled Hygro-Thermo-Mechanical Analysis of Moisture Induced Interfacial Stresses in Fan-Out Package

Ji Yen Wu, Ting Wen Chen, Tz Cheng Chiu, Dao Long Chen, Tang Yuan Chen, Meng Kai Shih

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

For evaluating the hygro-thermo-mechanical reliability of fan-out (FO) wafer-level package, a coupled-field finite element (FE) model was developed to evaluate the moisture concentration and stresses at materials interfaces in a FO package structure. A series of moisture absorption experiments were first carried out on epoxy molding compound (EMC) under various temperature and relative humidity (RH) conditions. Material parameters for moisture absorption models including saturation concentration, diffusivity and coefficient of hygroscopic swelling (CHS) were obtained from fitting to the experimental results. These models were then implemented in a coupled FE simulation to estimate the evolutions of moisture concentration, package warpage and peel stresses at EMC-Si and polyimide (PI)-Cu interface corners under moisture sensitivity level (MSL) testing. The peel stresses were considered as the driving forces of the interface delaminations caused by moisture absorption. The experimentally fitted moisture diffusion model and the coupled hygro-thermo-mechanical simulation model established in this study can be used for evaluate the effects of geometry and materials on the moisture sensitivity of FO wafer level packages.

Original languageEnglish
Title of host publicationIMPACT 2019 - 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Proceeding
PublisherIEEE Computer Society
Pages76-79
Number of pages4
ISBN (Electronic)9781728160702
DOIs
Publication statusPublished - 2019 Oct
Event14th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2019 - Taipei, Taiwan
Duration: 2019 Oct 232019 Oct 25

Publication series

NameProceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
Volume2019-October
ISSN (Print)2150-5934
ISSN (Electronic)2150-5942

Conference

Conference14th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2019
CountryTaiwan
CityTaipei
Period19-10-2319-10-25

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Control and Systems Engineering
  • Electrical and Electronic Engineering

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