Coupled power and thermal cycling reliability of board-level package-on-package stacking assembly

Tong Hong Wang, Yi Shao Lai, Chang Chi Lee, Yu-Cheng Lin

Research output: Contribution to journalArticle

9 Citations (Scopus)

Abstract

In this paper, the sequential thermal-mechanical coupling analysis, which solves in turn the transient temperature field and subsequent thermomechanical deformations, is performed to investigate thermal characteristics along with fatigue reliability of a board-level package-on-package (PoP) stacking assembly under coupled power and thermal cycling test conditions. Effects of powering sequences on thermal characteristics and fatigue reliability of the PoP are examined. The numerical analysis shows that coupled power and thermal cycling creates temperature excursions based on the thermal cycling profile. Also, reliability of the PoP is highly related to the range of temperature excursions and the degree of deviation of the temperature profile from the thermal cycling profile.

Original languageEnglish
Pages (from-to)14-21
Number of pages8
JournalIEEE Transactions on Electronics Packaging Manufacturing
Volume32
Issue number1
DOIs
Publication statusPublished - 2009 Jan 1

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Thermal cycling
Fatigue of materials
Temperature
Numerical analysis
Temperature distribution
Hot Temperature

All Science Journal Classification (ASJC) codes

  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

Cite this

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Coupled power and thermal cycling reliability of board-level package-on-package stacking assembly. / Wang, Tong Hong; Lai, Yi Shao; Lee, Chang Chi; Lin, Yu-Cheng.

In: IEEE Transactions on Electronics Packaging Manufacturing, Vol. 32, No. 1, 01.01.2009, p. 14-21.

Research output: Contribution to journalArticle

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