Coupled power and thermal cycling reliability of board-level package-on-package stacking assembly

Tong Hong Wang, Yi Shao Lai, Chang Chi Lee, Yu-Cheng Lin

Research output: Contribution to journalArticlepeer-review

10 Citations (Scopus)

Fingerprint

Dive into the research topics of 'Coupled power and thermal cycling reliability of board-level package-on-package stacking assembly'. Together they form a unique fingerprint.

Engineering & Materials Science