Coupling of MnZn-ferrite films onto electronic components by a novel solution process for high frequency applications

Subramani K. Ailoor, Takaaki Taniguchi, Koichi Kondo, Masaru Tada, Takashi Nakagawa, Masanori Abe, Masahiro Yoshimura, Nobuhiro Matsushita

Research output: Contribution to journalArticlepeer-review

12 Citations (Scopus)

Abstract

A novel approach for the preparation of "coupling-type noise suppressors" in which ferrite films are directly deposited onto the components of the printed circuit board is reported. Crystalline Mn xZnyFe3-x-yO4 films were fabricated on IC chips and polyimide substrates by a soft-chemistry route at temperatures below 100 °C. A "reaction-solution" comprising MCl2 (M = Mn, Zn, Fe) and an "oxidizing-solution" (pH buffer + oxidizing agent) were sprayed simultaneously onto a substrate maintained at 90 °C on a rotating disk. The as-prepared films were highly crystalline and hence do not require any post annealing. The magnetic and electrical properties of the films were studied. The films exhibited a large magnetic loss (imaginary permeability ″) in GHz range and also exhibited high resistivity in accordance to overcome the heat treatment during the reflow soldering process. Resistivity of 2 × 105 Ω sq-1 was found to be the lower limit for the coupling-type noise suppressors. Noise suppression of above 50% at 10 GHz was obtained for a 6.7 m thick MnZn-ferrite film and was equivalent to that of commercialized composite sheet noise suppressors of 50 m thickness.

Original languageEnglish
Pages (from-to)5510-5517
Number of pages8
JournalJournal of Materials Chemistry
Volume19
Issue number31
DOIs
Publication statusPublished - 2009 Aug 10

All Science Journal Classification (ASJC) codes

  • Chemistry(all)
  • Materials Chemistry

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