CoW alloy as multi-function diffusion barrier material for next-generation Cu metallization

Yin Hsien Su, Jia Nan Shih, Yu Sheng Wang, Wei Hsiang Tseng, Wei Hsiang Liao, Chun Yi Hung, Wen Hsi Lee, Ying Lang Wang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

In this study, CoW alloy co-sputtered with various conditions was investigated as a Cu diffusion barrier to replace the conventional Cu seed/liner/barrier structure. By fabricating Cu/CoW/Si stacks, we found that under certain Co/W ratio, CoW layers showed similar wetting ability with Ta and can avoid Cu diffusion up to 570 °C for 56 min. Furthermore, Cu was found capable to be directly electroplated on CoW layers. As a result, a single layer of CoW alloy which demonstrates electroplating, wetting and barrier ability simultaneously could become a promising material for next-generation Cu metallization.

Original languageEnglish
Title of host publication4th International Symposium on Next-Generation Electronics, IEEE ISNE 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781479942084
DOIs
Publication statusPublished - 2015 Jun 23
Event4th International Symposium on Next-Generation Electronics, IEEE ISNE 2015 - Taipei, Taiwan
Duration: 2015 May 42015 May 6

Publication series

Name4th International Symposium on Next-Generation Electronics, IEEE ISNE 2015

Other

Other4th International Symposium on Next-Generation Electronics, IEEE ISNE 2015
CountryTaiwan
CityTaipei
Period15-05-0415-05-06

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

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