@inproceedings{965779d90fef4ee8aaa9e17de5eca82d,
title = "CoW alloy as multi-function diffusion barrier material for next-generation Cu metallization",
abstract = "In this study, CoW alloy co-sputtered with various conditions was investigated as a Cu diffusion barrier to replace the conventional Cu seed/liner/barrier structure. By fabricating Cu/CoW/Si stacks, we found that under certain Co/W ratio, CoW layers showed similar wetting ability with Ta and can avoid Cu diffusion up to 570 °C for 56 min. Furthermore, Cu was found capable to be directly electroplated on CoW layers. As a result, a single layer of CoW alloy which demonstrates electroplating, wetting and barrier ability simultaneously could become a promising material for next-generation Cu metallization.",
author = "Su, {Yin Hsien} and Shih, {Jia Nan} and Wang, {Yu Sheng} and Tseng, {Wei Hsiang} and Liao, {Wei Hsiang} and Hung, {Chun Yi} and Lee, {Wen Hsi} and Wang, {Ying Lang}",
year = "2015",
month = jun,
day = "23",
doi = "10.1109/ISNE.2015.7132035",
language = "English",
series = "4th International Symposium on Next-Generation Electronics, IEEE ISNE 2015",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "4th International Symposium on Next-Generation Electronics, IEEE ISNE 2015",
address = "United States",
note = "4th International Symposium on Next-Generation Electronics, IEEE ISNE 2015 ; Conference date: 04-05-2015 Through 06-05-2015",
}