Crackless linear through-wafer etching of Pyrex glass using liquid-assisted CO2 laser processing (Applied Physics A DOI: 10.1007/s00339-008- 4863-x)

C. K. Chung; Y. C. Sung; G. R. Huang; E. J. Hsiao; W. H. Lin; S. L. Lin

doi:10.1007/s00339-008-4949-5

Crackless linear through-wafer etching of Pyrex glass using liquid-assisted CO₂ laser processing (Applied Physics A DOI: 10.1007/s00339-008- 4863-x)

C. K. Chung, Y. C. Sung, G. R. Huang, E. J. Hsiao, W. H. Lin, S. L. Lin

Department of Mechanical Engineering

Research output: Contribution to journal › Comment/debate › peer-review

1 Citation (Scopus)

Original language	English
Pages (from-to)	213
Number of pages	1
Journal	Applied Physics A: Materials Science and Processing
Volume	94
Issue number	1
DOIs	https://doi.org/10.1007/s00339-008-4949-5
Publication status	Published - 2009 Jan

All Science Journal Classification (ASJC) codes

Chemistry(all)
Materials Science(all)

Access to Document

10.1007/s00339-008-4949-5

Cite this

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title = "Crackless linear through-wafer etching of Pyrex glass using liquid-assisted CO2 laser processing (Applied Physics A DOI: 10.1007/s00339-008- 4863-x)",

author = "Chung, {C. K.} and Sung, {Y. C.} and Huang, {G. R.} and Hsiao, {E. J.} and Lin, {W. H.} and Lin, {S. L.}",

year = "2009",

month = jan,

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language = "English",

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pages = "213",

journal = "Applied Physics A: Materials Science and Processing",

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Crackless linear through-wafer etching of Pyrex glass using liquid-assisted CO₂ laser processing (Applied Physics A DOI : 10.1007/s00339-008- 4863-x). / Chung, C. K.; Sung, Y. C.; Huang, G. R.; Hsiao, E. J.; Lin, W. H.; Lin, S. L.

In: Applied Physics A: Materials Science and Processing, Vol. 94, No. 1, 01.2009, p. 213.

Research output: Contribution to journal › Comment/debate › peer-review

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T2 - 10.1007/s00339-008- 4863-x)

AU - Chung, C. K.

AU - Sung, Y. C.

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AU - Lin, S. L.

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DO - 10.1007/s00339-008-4949-5

M3 - Comment/debate

AN - SCOPUS:56349101087

VL - 94

SP - 213

JO - Applied Physics A: Materials Science and Processing

JF - Applied Physics A: Materials Science and Processing

SN - 0947-8396

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