Crackless linear through-wafer etching of Pyrex glass using liquid-assisted CO2 laser processing (Applied Physics A DOI: 10.1007/s00339-008- 4863-x)

C. K. Chung, Y. C. Sung, G. R. Huang, E. J. Hsiao, W. H. Lin, S. L. Lin

Research output: Contribution to journalComment/debatepeer-review

1 Citation (Scopus)
Original languageEnglish
Pages (from-to)213
Number of pages1
JournalApplied Physics A: Materials Science and Processing
Volume94
Issue number1
DOIs
Publication statusPublished - 2009 Jan

All Science Journal Classification (ASJC) codes

  • Chemistry(all)
  • Materials Science(all)

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