Abstract
To prevent glass cracking from external mechanical damages, chemically strengthened glass is usually employed. The cutting of strengthened glass becomes critical due to their residual tensile stress induced in the inner core of glass attributed to the ion exchange process. This paper describes a novel technique for dealing cutting interior holes and separation of strengthened ultrathin glass for the display unit of mobile communication and computational devices. This method integrates picosecond laser ablation with quenching induced thermo-shock for accomplishing such a task. Essential analyses are performed based on fracture mechanics and finite element method to provide the scientific basis of such an approach. Experimental results indicate that with a proper temperature control, the proposed method could achieve successful separations for various enclosed shapes with the associated surface roughness satisfying the requirement.
| Original language | English |
|---|---|
| Article number | 111723 |
| Journal | Sensors and Actuators, A: Physical |
| Volume | 301 |
| DOIs | |
| Publication status | Published - 2020 Jan 1 |
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All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Instrumentation
- Condensed Matter Physics
- Surfaces, Coatings and Films
- Metals and Alloys
- Electrical and Electronic Engineering
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Crafting interior holes on chemically strengthened thin glass based on ultrafast laser ablation and thermo-shock crack propagations. / Chuang, C. F.; Chen, K. S.; Chiu, T. C.; Yang, T. S.; Lin, M. C.
In: Sensors and Actuators, A: Physical, Vol. 301, 111723, 01.01.2020.Research output: Contribution to journal › Article
TY - JOUR
T1 - Crafting interior holes on chemically strengthened thin glass based on ultrafast laser ablation and thermo-shock crack propagations
AU - Chuang, C. F.
AU - Chen, K. S.
AU - Chiu, T. C.
AU - Yang, T. S.
AU - Lin, M. C.
PY - 2020/1/1
Y1 - 2020/1/1
N2 - To prevent glass cracking from external mechanical damages, chemically strengthened glass is usually employed. The cutting of strengthened glass becomes critical due to their residual tensile stress induced in the inner core of glass attributed to the ion exchange process. This paper describes a novel technique for dealing cutting interior holes and separation of strengthened ultrathin glass for the display unit of mobile communication and computational devices. This method integrates picosecond laser ablation with quenching induced thermo-shock for accomplishing such a task. Essential analyses are performed based on fracture mechanics and finite element method to provide the scientific basis of such an approach. Experimental results indicate that with a proper temperature control, the proposed method could achieve successful separations for various enclosed shapes with the associated surface roughness satisfying the requirement.
AB - To prevent glass cracking from external mechanical damages, chemically strengthened glass is usually employed. The cutting of strengthened glass becomes critical due to their residual tensile stress induced in the inner core of glass attributed to the ion exchange process. This paper describes a novel technique for dealing cutting interior holes and separation of strengthened ultrathin glass for the display unit of mobile communication and computational devices. This method integrates picosecond laser ablation with quenching induced thermo-shock for accomplishing such a task. Essential analyses are performed based on fracture mechanics and finite element method to provide the scientific basis of such an approach. Experimental results indicate that with a proper temperature control, the proposed method could achieve successful separations for various enclosed shapes with the associated surface roughness satisfying the requirement.
UR - http://www.scopus.com/inward/record.url?scp=85075775895&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85075775895&partnerID=8YFLogxK
U2 - 10.1016/j.sna.2019.111723
DO - 10.1016/j.sna.2019.111723
M3 - Article
AN - SCOPUS:85075775895
VL - 301
JO - Sensors and Actuators, A: Physical
JF - Sensors and Actuators, A: Physical
SN - 0924-4247
M1 - 111723
ER -