Crafting interior holes on chemically strengthened thin glass based on ultrafast laser ablation and thermo-shock crack propagations

C. F. Chuang, K. S. Chen, T. C. Chiu, T. S. Yang, M. C. Lin

Research output: Contribution to journalArticle

Abstract

To prevent glass cracking from external mechanical damages, chemically strengthened glass is usually employed. The cutting of strengthened glass becomes critical due to their residual tensile stress induced in the inner core of glass attributed to the ion exchange process. This paper describes a novel technique for dealing cutting interior holes and separation of strengthened ultrathin glass for the display unit of mobile communication and computational devices. This method integrates picosecond laser ablation with quenching induced thermo-shock for accomplishing such a task. Essential analyses are performed based on fracture mechanics and finite element method to provide the scientific basis of such an approach. Experimental results indicate that with a proper temperature control, the proposed method could achieve successful separations for various enclosed shapes with the associated surface roughness satisfying the requirement.

Original languageEnglish
Article number111723
JournalSensors and Actuators, A: Physical
Volume301
DOIs
Publication statusPublished - 2020 Jan 1

Fingerprint

Ultrafast lasers
crack propagation
Laser ablation
laser ablation
Crack propagation
shock
Glass
glass
fracture mechanics
temperature control
tensile stress
Fracture mechanics
Temperature control
Tensile stress
residual stress
Quenching
Residual stresses
Ion exchange
finite element method
surface roughness

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Instrumentation
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Electrical and Electronic Engineering

Cite this

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Crafting interior holes on chemically strengthened thin glass based on ultrafast laser ablation and thermo-shock crack propagations. / Chuang, C. F.; Chen, K. S.; Chiu, T. C.; Yang, T. S.; Lin, M. C.

In: Sensors and Actuators, A: Physical, Vol. 301, 111723, 01.01.2020.

Research output: Contribution to journalArticle

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