Creep-fatigue damage analysis of solder joints

S. H. Ju, S. Kuskowski, B. I. Sandor, M. E. Plesha

Research output: Contribution to journalConference article

23 Citations (Scopus)

Abstract

An anisotropic model of continuum damage mechanics has been developed to predict the creep-fatigue life of solder joints. With the help of the finite element method, the stress, strain, and damage fields of the time-dependent and temperature-dependent solder can be obtained. The main advantages of this model include: (1) It can predict the initial crack location and time and the subsequent crack growth paths; (2) The damage analysis is almost the same as in traditional viscoelastic finite element analysis; (3) It can be applied to a complex structure with any loading; (4) It provides a full-field damage investigation of the structure. This damage theory can be used for various solder joints and also can be applied to analyze the creep-fatigue problems of other ductile and temperature-dependent materials. Extensive experiments including uniaxial creep, uniaxial fatigue, tension-torsion, Moire, and bimaterial tests were performed to validate the new model. These validations and comparisons indicate that this model can predict adequately crack growth paths and fatigue lives of solder joints.

Original languageEnglish
Pages (from-to)1-21
Number of pages21
JournalASTM Special Technical Publication
Issue number1153
DOIs
Publication statusPublished - 1994 Jan 1
EventSymposium on Fatigue of Electronic Materials - Atlanta, GA, USA
Duration: 1993 May 171993 May 17

All Science Journal Classification (ASJC) codes

  • Engineering(all)

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