Cu-based alloys for 3DP by melt extrusion process

C. S. Chou, W. C.J. Wei, Bernard Haochih Liu, A. B. Wang, R. C. Luo

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A feasible method to extrude Cu-based alloys by a high-temperature melt-extrusion (ME) module and the property characterization of Cu-Zn alloys were conducted. The ME module assembled on 3D Printer (3DP) had different designs from traditional 3DP. The module for 3DP applications has superior characteristics, such as 1100oC-extrusion capability, high heating rate (930 oC/ 5 min), good thermal insulation, compact and light weight. Various Cu-based alloys, i.e. Cu-Zn alloys, were selected and prepared as the feedstock filaments for the ME 3DP. Oxidation kinetics of 8020 Cu-Zn alloy, pure Cu, and other metallic alloys were investigated and compared to that in N2 atmosphere. Besides, the electric conductivity is reported and discussed.

Original languageEnglish
Title of host publicationProceedings - 2016 IEEE International Conference on Industrial Technology, ICIT 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1152-1157
Number of pages6
ISBN (Electronic)9781467380751
DOIs
Publication statusPublished - 2016 May 19
EventIEEE International Conference on Industrial Technology, ICIT 2016 - Taipei, Taiwan
Duration: 2016 Mar 142016 Mar 17

Publication series

NameProceedings of the IEEE International Conference on Industrial Technology
Volume2016-May

Other

OtherIEEE International Conference on Industrial Technology, ICIT 2016
CountryTaiwan
CityTaipei
Period16-03-1416-03-17

Fingerprint

3D printers
Extrusion
Thermal insulation
Heating rate
Feedstocks
Oxidation
Kinetics

All Science Journal Classification (ASJC) codes

  • Computer Science Applications
  • Electrical and Electronic Engineering

Cite this

Chou, C. S., Wei, W. C. J., Liu, B. H., Wang, A. B., & Luo, R. C. (2016). Cu-based alloys for 3DP by melt extrusion process. In Proceedings - 2016 IEEE International Conference on Industrial Technology, ICIT 2016 (pp. 1152-1157). [7474918] (Proceedings of the IEEE International Conference on Industrial Technology; Vol. 2016-May). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICIT.2016.7474918
Chou, C. S. ; Wei, W. C.J. ; Liu, Bernard Haochih ; Wang, A. B. ; Luo, R. C. / Cu-based alloys for 3DP by melt extrusion process. Proceedings - 2016 IEEE International Conference on Industrial Technology, ICIT 2016. Institute of Electrical and Electronics Engineers Inc., 2016. pp. 1152-1157 (Proceedings of the IEEE International Conference on Industrial Technology).
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Chou, CS, Wei, WCJ, Liu, BH, Wang, AB & Luo, RC 2016, Cu-based alloys for 3DP by melt extrusion process. in Proceedings - 2016 IEEE International Conference on Industrial Technology, ICIT 2016., 7474918, Proceedings of the IEEE International Conference on Industrial Technology, vol. 2016-May, Institute of Electrical and Electronics Engineers Inc., pp. 1152-1157, IEEE International Conference on Industrial Technology, ICIT 2016, Taipei, Taiwan, 16-03-14. https://doi.org/10.1109/ICIT.2016.7474918

Cu-based alloys for 3DP by melt extrusion process. / Chou, C. S.; Wei, W. C.J.; Liu, Bernard Haochih; Wang, A. B.; Luo, R. C.

Proceedings - 2016 IEEE International Conference on Industrial Technology, ICIT 2016. Institute of Electrical and Electronics Engineers Inc., 2016. p. 1152-1157 7474918 (Proceedings of the IEEE International Conference on Industrial Technology; Vol. 2016-May).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Chou CS, Wei WCJ, Liu BH, Wang AB, Luo RC. Cu-based alloys for 3DP by melt extrusion process. In Proceedings - 2016 IEEE International Conference on Industrial Technology, ICIT 2016. Institute of Electrical and Electronics Engineers Inc. 2016. p. 1152-1157. 7474918. (Proceedings of the IEEE International Conference on Industrial Technology). https://doi.org/10.1109/ICIT.2016.7474918