Current stressing-induced growth of Cu3Sn in Cu/Sn/Cu solder joints

Delphic Chen, Cheng En Ho, Jui Chao Kuo

Research output: Contribution to journalArticlepeer-review

13 Citations (Scopus)


We investigated the influence of current stressing on a crystallographic microstructure of intermetallics in Cu/Sn/Cu solder joints using electron backscatter diffraction (EBSD). After direct current (DC) stressing at 150 °C for 10 d, the total Sn of the Cu/Sn/Cu was converted into a tri-layer structure of Cu3Sn/Cu6Sn5/Cu3Sn. The Cu3Sn layers that grew on the cathode and anode are asymmetrical during DC stressing. A preferred direction < 010> Cu3Sn along the current direction on the anode was found after current stressing.

Original languageEnglish
Pages (from-to)1276-1279
Number of pages4
JournalMaterials Letters
Issue number9
Publication statusPublished - 2011 May 15

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering


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