Data Mining for Delamination Diagnosis in the Semiconductor Assembly Process

Shao Yen Hung, Yung Lun Lin, Chia Yen Lee

Research output: Contribution to journalArticlepeer-review

3 Citations (Scopus)


The delamination in die-attach layer is a problem that results in defects of semiconductor products. There are several elements and parameters, which are difficultly observed, causing delamination during the assembly process. Thus, it's critical to identify abnormal factors immediately for the real-time correction and improvement. This paper proposes a two-stage analysis framework to achieve two goals: identifying the key factors affecting delamination via variable selection and predicting the ratio of the delamination area in a die via the prediction models.

Original languageEnglish
Pages (from-to)1976-1983
Number of pages8
JournalProcedia Manufacturing
Publication statusPublished - 2017

All Science Journal Classification (ASJC) codes

  • Industrial and Manufacturing Engineering
  • Artificial Intelligence


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