Deep nickel metal deposition on multiscale feature sizes of a small hole and large sector cavities using electroforming

Chen-Kuei Chung, Wei Tse Chang

Research output: Contribution to journalArticle

Abstract

The deep nickel metal deposition on multiscale features with a single small hole and large sector cavities with depth of 1 mm has been investigated using direct current (DC) and pulse alternating current (AC) electroforming. The diameter of the hole is around 240 μm, and the size of the sector cavity is several mm to cm corresponding to the various aspect ratios from 0.07 to 4.17. The successful metal electroforming into both the hole and cavity features can be obtained by the AC mode, while the DC mode leads to metal electroforming only in sector cavities rather than in the small hole. This is because the surface concentration of the cathode in pulse electroforming is higher than that in DC electroforming, allowing large cations to diffuse into different multiscale features at lower overpotential. The increment factor, i.e., percentage increase in concentration used as an index of the varied surface concentration increases from 0.903 (10-2%) at 1 Hz to 1.077 (10-2%) at 100 Hz. This achievement can be used for the high aspect ratio metal electroforming of a single hole as a micro-sensing tip in different applications.

Original languageEnglish
Article number021111
JournalJournal of Micro/Nanolithography, MEMS, and MOEMS
Volume8
Issue number2
DOIs
Publication statusPublished - 2009 Jan 1

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Electroforming
electroforming
Nickel
sectors
Metals
nickel
cavities
metals
direct current
Aspect ratio
alternating current
pulses
high aspect ratio
Cations
aspect ratio
Cathodes
cathodes
Positive ions
cations

All Science Journal Classification (ASJC) codes

  • Condensed Matter Physics
  • Atomic and Molecular Physics, and Optics
  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering
  • Mechanical Engineering

Cite this

@article{2f29640e195749b48a9dd04860a57160,
title = "Deep nickel metal deposition on multiscale feature sizes of a small hole and large sector cavities using electroforming",
abstract = "The deep nickel metal deposition on multiscale features with a single small hole and large sector cavities with depth of 1 mm has been investigated using direct current (DC) and pulse alternating current (AC) electroforming. The diameter of the hole is around 240 μm, and the size of the sector cavity is several mm to cm corresponding to the various aspect ratios from 0.07 to 4.17. The successful metal electroforming into both the hole and cavity features can be obtained by the AC mode, while the DC mode leads to metal electroforming only in sector cavities rather than in the small hole. This is because the surface concentration of the cathode in pulse electroforming is higher than that in DC electroforming, allowing large cations to diffuse into different multiscale features at lower overpotential. The increment factor, i.e., percentage increase in concentration used as an index of the varied surface concentration increases from 0.903 (10-2{\%}) at 1 Hz to 1.077 (10-2{\%}) at 100 Hz. This achievement can be used for the high aspect ratio metal electroforming of a single hole as a micro-sensing tip in different applications.",
author = "Chen-Kuei Chung and Chang, {Wei Tse}",
year = "2009",
month = "1",
day = "1",
doi = "10.1117/1.3116126",
language = "English",
volume = "8",
journal = "Journal of Micro/ Nanolithography, MEMS, and MOEMS",
issn = "1932-5150",
publisher = "SPIE",
number = "2",

}

TY - JOUR

T1 - Deep nickel metal deposition on multiscale feature sizes of a small hole and large sector cavities using electroforming

AU - Chung, Chen-Kuei

AU - Chang, Wei Tse

PY - 2009/1/1

Y1 - 2009/1/1

N2 - The deep nickel metal deposition on multiscale features with a single small hole and large sector cavities with depth of 1 mm has been investigated using direct current (DC) and pulse alternating current (AC) electroforming. The diameter of the hole is around 240 μm, and the size of the sector cavity is several mm to cm corresponding to the various aspect ratios from 0.07 to 4.17. The successful metal electroforming into both the hole and cavity features can be obtained by the AC mode, while the DC mode leads to metal electroforming only in sector cavities rather than in the small hole. This is because the surface concentration of the cathode in pulse electroforming is higher than that in DC electroforming, allowing large cations to diffuse into different multiscale features at lower overpotential. The increment factor, i.e., percentage increase in concentration used as an index of the varied surface concentration increases from 0.903 (10-2%) at 1 Hz to 1.077 (10-2%) at 100 Hz. This achievement can be used for the high aspect ratio metal electroforming of a single hole as a micro-sensing tip in different applications.

AB - The deep nickel metal deposition on multiscale features with a single small hole and large sector cavities with depth of 1 mm has been investigated using direct current (DC) and pulse alternating current (AC) electroforming. The diameter of the hole is around 240 μm, and the size of the sector cavity is several mm to cm corresponding to the various aspect ratios from 0.07 to 4.17. The successful metal electroforming into both the hole and cavity features can be obtained by the AC mode, while the DC mode leads to metal electroforming only in sector cavities rather than in the small hole. This is because the surface concentration of the cathode in pulse electroforming is higher than that in DC electroforming, allowing large cations to diffuse into different multiscale features at lower overpotential. The increment factor, i.e., percentage increase in concentration used as an index of the varied surface concentration increases from 0.903 (10-2%) at 1 Hz to 1.077 (10-2%) at 100 Hz. This achievement can be used for the high aspect ratio metal electroforming of a single hole as a micro-sensing tip in different applications.

UR - http://www.scopus.com/inward/record.url?scp=80055034500&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=80055034500&partnerID=8YFLogxK

U2 - 10.1117/1.3116126

DO - 10.1117/1.3116126

M3 - Article

VL - 8

JO - Journal of Micro/ Nanolithography, MEMS, and MOEMS

JF - Journal of Micro/ Nanolithography, MEMS, and MOEMS

SN - 1932-5150

IS - 2

M1 - 021111

ER -