Delamination fracture characteristics for polyimide-related interfaces under fatigue loadings

S. W. Zhu, C. P. Shih, Tz-Cheng Chiu, G. S. Shen

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Abstract

The fracture responses of interfaces under either monotonic or fatigue loading conditions were investigated by using double cantilever beam (DCB) tests. The tests were performed using a custom-developed micro-tester. The applied load vs. interfacial crack opening relationship obtained from the DCB experiment was analyzed by using a beam on elastic foundation-based closed-form expression for determining the critical strain energy release rate or the fatigue delamination growth rate for the interface of interest. From the analysis the relationship between the crack growth rate and the applied strain energy release rate range was determined. For the polyimide-SiN interface, the subcritical fatigue delamination growth rate was found to display a power-law dependence on the applied strain energy release rate range with an exponent of 3.2.

Original languageEnglish
Title of host publicationInternational Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings
DOIs
Publication statusPublished - 2010 Dec 1
Event2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference - Taipei, Taiwan
Duration: 2010 Oct 202010 Oct 22

Publication series

NameInternational Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings

Other

Other2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference
CountryTaiwan
CityTaipei
Period10-10-2010-10-22

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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