TY - GEN
T1 - Delamination fracture characteristics for polyimide-related interfaces under fatigue loadings
AU - Zhu, S. W.
AU - Shih, C. P.
AU - Chiu, Tz-Cheng
AU - Shen, G. S.
PY - 2010/12/1
Y1 - 2010/12/1
N2 - The fracture responses of interfaces under either monotonic or fatigue loading conditions were investigated by using double cantilever beam (DCB) tests. The tests were performed using a custom-developed micro-tester. The applied load vs. interfacial crack opening relationship obtained from the DCB experiment was analyzed by using a beam on elastic foundation-based closed-form expression for determining the critical strain energy release rate or the fatigue delamination growth rate for the interface of interest. From the analysis the relationship between the crack growth rate and the applied strain energy release rate range was determined. For the polyimide-SiN interface, the subcritical fatigue delamination growth rate was found to display a power-law dependence on the applied strain energy release rate range with an exponent of 3.2.
AB - The fracture responses of interfaces under either monotonic or fatigue loading conditions were investigated by using double cantilever beam (DCB) tests. The tests were performed using a custom-developed micro-tester. The applied load vs. interfacial crack opening relationship obtained from the DCB experiment was analyzed by using a beam on elastic foundation-based closed-form expression for determining the critical strain energy release rate or the fatigue delamination growth rate for the interface of interest. From the analysis the relationship between the crack growth rate and the applied strain energy release rate range was determined. For the polyimide-SiN interface, the subcritical fatigue delamination growth rate was found to display a power-law dependence on the applied strain energy release rate range with an exponent of 3.2.
UR - http://www.scopus.com/inward/record.url?scp=79951638389&partnerID=8YFLogxK
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U2 - 10.1109/IMPACT.2010.5699574
DO - 10.1109/IMPACT.2010.5699574
M3 - Conference contribution
AN - SCOPUS:79951638389
SN - 9781424497836
T3 - International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings
BT - International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings
T2 - 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference
Y2 - 20 October 2010 through 22 October 2010
ER -